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Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Specifications
Brand Name :
Hiner-pack
Model Number :
Jedec standard tray 322.6*135.9*7.62&12.19mm
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms :
T/T
Supply Ability :
The capacity is between 2500PCS~3000PCS/per day
Delivery Time :
5~8 working days
Packaging Details :
80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Material :
MPPO
Color :
Black
Temperature :
125°C
Property :
ESD,Non-ESD
Surface resistance :
1.0x10E4~1.0x10E11Ω
Flatness :
less than 0.76mm
Clean Class :
General and ultrasonic cleaning
Incoterms :
EXW,FOB,CIF,DDU,DDP
Use :
Transport,Storage,Packing
HS Code :
39239000
Description
Waterproof Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Waterproof Black MPPO Standard Jedec Trays Can Be Designed For BGA IC Devices
Jedec trays is a standard-defined tray for transporting, handling, and storing complete chips and other components,and the production come in the very same outline dimensions of 12.7 inches by 5.35 inches (322.6 mm x 135.89 mm). Trays come in a number of different profiles.

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.

Industrial Use:Electronic
Feature:Recyclable
Custom Order:Accept
Place of Origin:Shenzhen, China (Mainland)
Brand Name:Hiner-pack
Model Number:HN1890
Surface resistance:10e4-10e11 ohms
Color:Black
Property:Antistatic/ESD
Thickess:7.62mm
CAD drawing:available
Customized:width, length, thickness as customer request
Offer Designing:Yes

Outline Line Size 322.6*135.9*7.62mm Brand Hiner-pack
Model HN 1890 Package Type BGA IC
Cavity Size 6*8*1 mm Matrix QTY 24*16=384PCS
Material MPPO Flatness MAX 0.76mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS
Product Advantage
1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japen...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.

Product Application

Electronic component Semiconductor Embedded System Display technology

Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply


Reference to temperature resistance of different materials

Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

FAQ

Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.

Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.

Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.

Q4: How about batch order production?
Ans: Normally 5-8days or so.

Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

Product tags

opmg200 pcb

,

ceneo laminat fr4 pcb

,

ltbrct351f lcd module
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Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

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Product Detail
Brand Name :
Hiner-pack
Model Number :
Jedec standard tray 322.6*135.9*7.62&12.19mm
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Contact Supplier
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Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

Shenzhen Hiner Technology Co.,LTD

Verified Supplier
5 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Main Products :
Jedec IC Trays, Jedec Matrix Trays, IC Chip Tray
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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