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QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
Specifications
Brand Name :
Hiner-pack
Model Number :
HN1968
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms :
T/T
Supply Ability :
The capacity is between 2500PCS~3000PCS/per day
Delivery Time :
5~8 working days
Packaging Details :
80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Material :
PPE
Color :
Black
Temperature :
125°C
Property :
ESD
Surface resistance :
1.0x10E4~1.0x10E11Ω
Flatness :
less than 0.76mm
Incoterms :
EXW,FOB,CIF,DDU,DDP
Customized service :
Support standard and non-standard,precision machining
Description
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
Anti-static PPE Standard Jedec Trays Customized For Carry QFP Package IC
Detail Description:
Tray of QFP package way,Really need to pay special attention to protect the edge of the pin location, structure and shape, different pin each sensitive area is different need to be protected, IC tray design is the first need to consider is safe packing storage chip, the IC package of reason for different ways have different design methods, this QFP IC two side both have pin structure,Our designer added grooves on both sides, so that the pins can be placed smoothly to avoid being touched, and the middle card slot can also be fixed on the chip, so that it can be picked up by automatic equipment on the basis of safe storage of the chip, which is more conducive to shipment and storage.
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.
Outline Line Size 322.6*135.9*12.19mm Brand Hiner-pack
Model HN1968 Package Type QFP IC
Cavity Size 22*22*6.9 Matrix QTY 11*4=44pcs
Material PPE Flatness MAX 0.76mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS

Product Application

Package IC PCBA module component

Electronic component packaging Optical device packaging


Packaging


Packaging Details:Packing according to customer's specified size

Reference to temperature resistance of different materials

Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness

FAQ


1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness

Product tags

pcb tg 180

,

fr4 0.8mm double sided pcb

,

tg 180 pcb
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QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness

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Product Detail
Brand Name :
Hiner-pack
Model Number :
HN1968
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Contact Supplier
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness
QFP Package ESD IC Trays Jedec Standard Max 0.76mm Flatness

Shenzhen Hiner Technology Co.,LTD

Verified Supplier
5 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Main Products :
Jedec IC Trays, Jedec Matrix Trays, IC Chip Tray
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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