PC Waffle Pack Chip Trays For Optoelectronics Industry Loaded

Customized Waffle Pack For Optoelectronics Industry Loaded With Microlenses

Waffle pack is widely used in semiconductor, photoelectric industry customers of the product requires a high degree of cleanliness and size, we from the design drawings, mold manufacturing, product manufacturing to cleaning packing and so on, all of the steps and operations through strict quality control, to deliver the ultimate goal of customer satisfaction for product, continuously meet the customer's requirements, To promote our factory to a higher level of progress.

Waffle pack compared with other method has many advantages, it can be placed not only very tiny components or parts, and the flexibility to match the lid and clip to raise product real ease of use, can satisfy the customer the different demand for samples and production loading respectively, at the same time can also be applied to automated production, easy to use and save the packaging cost.

Advantages

1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japan...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.

Product Application

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc

FAQ

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

For more information, please contact our sales department

Hiner-Pack 4 Inch Waffle Pack Catalogue.pdf