Features:

The JEDEC trays have been specifically designed and manufactured to fit seamlessly with standard handling and testing equipment. They are readily compatible with pick-and-place machines which greatly streamlines the manufacturing process.

The JEDEC trays have been designed for multiple uses, making them an excellent cost-effective and environmentally friendly solution for semiconductor packaging. Their reusability minimizes waste and lowers operational costs.

While there are standard designs available for JEDEC trays, some manufacturers offer additional customization to accommodate specific device shapes or sizes. This provides flexibility in the manufacturing process and ensures that the trays can be tailored to meet individual requirements.

Technical Parameters:

The JEDEC TRAY structure and shape conforms with international standards, which not only satisfies the requirements for carrying electronic components and various packaging ICs, but also aligns with the needs for automatic feeding system by customers, matching automation equipment for loading with ease and delivering efficient work efficiency.

At Hiner-pack, our customized JEDEC TRAY is designed to 100% meet your IC's specifics, providing tailored protection solutions based on its chip packaging. Our website showcases our range of JEDEC TRAY designs for multiple packaging type, including but not limited to BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and others. We can deliver effective design solutions and effective wafer-level package protection for your products.

Applications:

JEDEC trays are a crucial element in the semiconductor industry due to their ability to guarantee secure and efficient handling of fragile electronic parts. The trays have extensive applications which include:

• Semiconductor manufacturing and assembly
• Electronic component testing
• Shipping and storage of sensitive devices, for instance, integrated circuits (ICs)

JEDEC trays are useful in safeguarding the delicate components during shipping and storage. They are also essential in ensuring that the electronic parts are well-positioned during component testing and semiconductor manufacturing and assembly process.

Packing and Shipping:

Product Packaging:

• The custom JEDEC trays will be packaged in a sturdy cardboard box to ensure safe transportation.
• The trays will be packed securely with bubble wrap or foam to prevent any damage during transit.
• Each box will contain a specified number of trays based on the customer's order.
• The box will be clearly labeled with the product name, quantity, and any necessary handling instructions.

Shipping:

• Shipping will be arranged by our team and will be in accordance with the customer's preferred method and location.
• We offer a range of shipping options including standard, express, and overnight delivery.
• The customer will be provided with a tracking number to monitor the progress of their shipment.
• If any issues arise during shipping, our customer service team will work to resolve them promptly.