Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facilities, JOPTEC now covers an area of 21,000 square meters and has developed a complete and mature process for the design, manufacturing, testing and quality inspection for hermetic metal-glass packages. Over the past few decades, JOPTEC’s capability, quality consistency and reliability have been recognized by customers worldwide that range from major international companies of high power laser, optical communication, defense and aerospace agencies to medical and research establishments.
Laser Components and Beyond
11Reflow Ovens (Sealing & Brazing)
8 Tubular Diffuser
4 Vacuum Brazing Oven
6 Automatic Assembling Machines
5 Manual Plating Lines
2 Automatic Plating Lines
5 Sanding Equipments
The annual output of packages accounts for 10 million sets
We have a total of 500 employees which include the management team, R&D team, staffs on the production lines, sales and QC team.
Master degree or above : 198
Senior professional position or above: 305
Expert with State Council special allowance : 3
Chief Expert : 4
Senior Expert: 10
Average age: 33 years old
Founded in 1988 in Hefei, China
R&D of East China Institute of Microelectronics established in 1993
Packaging Division set up in 2010
Overseas department formed in 2015
JOPTEC was authorized to focus on overseas market in 2019
JOPTEC Laser Co., Ltd is a high-tech enterprise which focuses on the research and development of high-end packaging and electronic material, The products fields cover metal packaging ,ceramic packaging and packaging materials, and the supporting solution is available for integrated packaging requirement.
JOPTEC is now possessed with the advanced R&D and production line for metal packages, AlN ceramic materials and electronic paste. It’s products are widely used in the civilian industries such as optical communication, high power laser, microwave, hybrid integrated circuit, power electronics, new materials etc. The current annual capacity of metal packaging packages reaches 5 million sets, DBC substrate (5 inch x 7 inch) 1 million pieces, AlN substrate 4000m2 and electronic paste 60 tons. Its customer groups can be found in dozens of countries and regions around the world. The company is renowned both inside and outside the industry for its complete design, R&D, manufacturing, testing and reliability assurance capabilities and mature standardized management level.