Specifications
Brand Name :
JOPTEC
Place of Origin :
HEFEI, CHINA
MOQ :
50 PCS
Payment Terms :
T/T
Supply Ability :
5000000 PCS/Month
Delivery Time :
30 Days
Packaging Details :
Boxes
Types of Ceramic :
Aluminum Nitride AlN
Flatness of chip mounting area :
≤ 2 um
Roughness of chip mounting area :
≤ 0.3 um
Plating thickness :
Ni (2-5um)
Water flow :
≥ 300ml/min
Description

Technical characteristics:

Micro channel heat sink

Flatness of chip mounting area ≤ 2 um

Roughness of chip mounting area ≤ 0.3 um

Plating thickness: Ni (2-5um)

Au (0.05-0.15um)

Water flow ≥ 300ml/min


High thermal conductivity aluminum nitride ceramic heat sink

Types of Ceramic: Aluminum Nitride AlN

Thermal conductivity: 200 W/m.K

Roughness of metallized area: Ra 0.5um Max

Flatness of metallized area: 5um Max

Copper thickness accuracy: 75±10 um

Preset gold tin solder: Au (75±5wt%) Sn

Send your message to this supplier
Send Now

Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

Ask Latest Price
Brand Name :
JOPTEC
Place of Origin :
HEFEI, CHINA
MOQ :
50 PCS
Payment Terms :
T/T
Supply Ability :
5000000 PCS/Month
Delivery Time :
30 Days
Contact Supplier
Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

JOPTEC LASER CO., LTD

Verified Supplier
5 Years
anhui, hefei
Since 1988
Business Type :
Manufacturer, Distributor/Wholesaler
Total Annual :
50000000-100000000
Employee Number :
500~1000
Certification Level :
Verified Supplier
Contact Supplier
Submit Requirement