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Wire Bond Surface Coining Base Transistor Outline Package
Wire Bond Surface Coining Base Transistor Outline Package
Wire Bond Surface Coining Base Transistor Outline Package
Wire Bond Surface Coining Base Transistor Outline Package
Wire Bond Surface Coining Base Transistor Outline Package
Wire Bond Surface Coining Base Transistor Outline Package
Specifications
Brand Name :
JOPTEC
Place of Origin :
HEFEI, CHINA
MOQ :
50 PCS
Payment Terms :
T/T
Supply Ability :
5000000 PCS/Month
Delivery Time :
30 Days
Packaging Details :
Boxes
Base :
4J29
Glass insulator :
BH-A/K
Insulation Resistance :
500V
Leak rate :
≤1*10^-3Pa.cm3/s
Shell adopt material :
FeNiCo,FeNi42 or CRS;
Description
Product Name Robust Coining Base with A Large Diameter Wire Bond Surface
Product Model JOPTEC
Plating Coating Fully plating Au or selective plating Au
Finish Shell and pins are plated Ni:2~11.43um and Au≥1.3um;Cap is plated Ni:2~11.43um
Product Formation Material Quantity
1. Base 4J29 1
2. Glass insulator BH-A/K 8
3. Pin 4J29 8
4. Cap 4J42 1
Insulation Resistance 500V DC resistance between all the pins linked and base is ≥1*10^9Ω
Hermeticity Leak rate is ≤1*10^-3Pa.cm3/s
Product Features 1. Shell adopt material: FeNiCo,FeNi42 or CRS;
2. The shape of pin is cyclinder and straight,material adopts Kovar.The shape of pin used as bonding is cyclinder or nailhead.
3. The sealing cap method is percussion welding or tin welding.
4. The rank of pin which cross the bottom of base could be choosen by customers.
5. The position of ground pin can be choosen by customer.
6. The design of caps need to fit the shell.
7. Customer could choose shell fully plating or pin selective plating.
Product tags

t slot aluminium profiles

,

for corner crimping aluminum profiles

,

t slot aluminum profiles
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Wire Bond Surface Coining Base Transistor Outline Package

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Product Detail
Brand Name :
JOPTEC
Place of Origin :
HEFEI, CHINA
MOQ :
50 PCS
Payment Terms :
T/T
Supply Ability :
5000000 PCS/Month
Delivery Time :
30 Days
Contact Supplier
Wire Bond Surface Coining Base Transistor Outline Package
Wire Bond Surface Coining Base Transistor Outline Package
Wire Bond Surface Coining Base Transistor Outline Package

JOPTEC LASER CO., LTD

Verified Supplier
5 Years
anhui, hefei
Since 1988
Business Type :
Manufacturer, Distributor/Wholesaler
Main Products :
Hermetically Sealed Electronic Packages, Hermetic High Power Laser Package, Hermetic Optical Fiber Communication Package
Total Annual :
50000000-100000000
Employee Number :
500~1000
Certification Level :
Verified Supplier
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