Layer | 1 to 20 layers |
Material Type | FR-4. CEM-3. High TG. FR4 Halogen Free, RIGID-FLEX |
Board Thickness | 0.20mm to 3.4mm |
Copper Thickness | 0.5 OZ to 6 OZ |
Copper Thickness in Hole | >25.0 um(>1mi) |
Max Size of Finish Board | 700*460mm |
Min.Drilled Hole Size | 1.0mm |
Min.Line Width | 3mil |
Min.Line Spacing | 3mil |
Surface finishing | HASL/HASL lead free,HAL,Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating |
Solder Mask Color | Green/Yellow/Black/White/Red/Blue |
Shape tolerance | ±4mil |
Hole tolerance | PTH:±3mil,NPTH:±2mil |
Package | Inner paking/Plastic bag,Outer packing:Standard carton packing |
Certificate | UL,SGS, ISO 9001:2008,IATF16949 |
Special requirements | Buried and blind vias+controlled impedance+BGA |
Profiling | Punching,Routing, V-CUT,Beveling |