n tooth instrument motherboard vacuum cleaner control board production
Essential details
- Place of Origin:
-
Guangdong, China
- Number of Layers:
-
2 Layer
- Base Material:
-
FR4
- Copper Thickness:
-
1oz
- Board Thickness:
-
1.6mm
- Min. Hole Size:
-
4mil
- Min. Line Width:
-
8mil
- Min. Line Spacing:
-
8mil
- Surface Finishing:
-
HASL
- Layer:
-
2-32 Layers
- Thickness:
-
1.6mm
- Material:
-
FR4
- Aspect:
-
30:1(Min. hole:0.4mm)
- Surface Finish:
-
HASL
- Tolerance of back drill (mm):
-
±0.05
- Tolerance of press fit holes (mm):
-
±0.05
- Surface treatment type:
-
OSP,sterling silver,ENIG
Base Material | Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df etc. |
Solder Mask Color | Green, Red, Blue, White, Yellow, Purple, Black |
Legend Color | white, yellow, black, red |
Surface treatment type | ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver |
Max. layer-up(L) | 50 |
Max. unit size (mm) | 620*813 (24"*32") |
Max. working panel size (mm) | 620*900 (24"x35.4") |
Max. board thickness (mm) | 12 |
Min. board thickness(mm) | 0.3 |
Board thickness tolerance (mm) | T<1.0mm: +/-0.1mm; T≥1.0mm: +/-10% |
Registration tolerance (mm) | +/-0.10 |
Min. mechanical drilling hole diameter (mm) | 0.15 |
Min. laser drilling hole diameter(mm) | 0.075 |
Max. aspect(through hole) | 15:1 |
Max. aspect(micro-via) | 1.3:1 |
