High frequency mixed compression plate multilayer plate gold sinking half-hole plate
Shenzhen Jieteng Circuit Co. , Ltd. , since its inception in 2009, people-oriented, has been focused on 1-60 layers of product technology research and development, PCB circuit board, PCBA high-precision Express and batch manufacturing, PCBA program development, small program and APP development
MPCB Manufacturing Capability |
| Aluminum Substrate Copper Substrate PCB | |
minimum linewidth/linespacing | | |
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minimum solder resist opening (single-side) | | |
minimum solder resist bridge | | |
maximum aspect Ratio (thickness/hole diameter) | | |
impedance control accuracy | | |
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maximum finished copper thickness | | |
maximum finished copper thickness | | |
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| OSPOSP,Immersion Au,Immersion Tin,Immersion Ag,Flash Gold,ENEPIG,LF HASL,carbon print | OS OSP,Immersion Au,Immersion Tin,Immersion Ag,Flash Gold,ENEPIG,LF HASL,carbon print |
