1, PCB drawing/design according to your schematic diagram.
2, PCB fabrication.
3, PCB manufacturing.
4, Component sourcing.
5, PCB Assembly
6, PCBA function test.
ITEM | TECHNICAL DATA | ITEM | TECHNICAL DATA |
Layers | 2-30(layers) |
Min Board Thickness | 4layers:0.40mm/16mil |
Max Board Size | 250x650mm | 6layers:0.80mm/32mil | |
Min Line Width | 0.10mm/4mil | 8layers:1.00mm/40mil | |
Min Line Space | 0.10mm/4mil | 10layers:1.20mm/48mil | |
Min Hole Size | 0.20mm/8mil | Insulation Resistance | 1E+12Ω(Normal) |
PTH Wall Thickness | 0.020mm/0.8mil | Aspect Ratio | 10:1 |
PTH Dia Tolerance | ±0.05mm/±2mil | Thermal Shock | 288℃/3x10Sec@288℃ |
NPTH Hole Dia Tolerance | ±0.025mm/±1mil | Warp and Twist | ≤0.7% |
Hole Position Deviation | ±0.05mm/±2mil | Electric Strength | >1.3KV/mm |
Outline Tolerance | ±0.1mm/±4mil | Peel Strength | 1.4N/mm |
S/M Pitch | 0.08mm/3mil | Solder Mask Abrasion | >6H |
Flammability | 94V-0 | Impedance Control | ±5% |