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FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process
FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process
Specifications
Brand Name :
JIETENG
Model Number :
FR4
Certification :
ISO/TS16949/RoHS/TS16949
Place of Origin :
china
MOQ :
Negotiable
Price :
Negotiable
Payment Terms :
Negotiable
Supply Ability :
150000 square meters / year
Delivery Time :
5-8 working day
Packaging Details :
Blank carton, vacuum packed
Base material :
FR-4
Solder mask :
Black Green Blue
Material :
Hight TG
Color :
green
Plugging vias capability :
0.2-0.8mm
Special requirements :
Copper filled vias and supplied stack-up
Description

FR4 TG180 multilayer printed circuit board immersion gold process

FR4 TG180 is a special type of substrate material used in the manufacture of printed circuit boards (PCBs). It has a glass transition temperature (Tg) of 180°C, indicating that it can withstand high temperatures during operation without losing its mechanical or electrical properties. A multilayer PCB made with FR4 TG180 material refers to a PCB with more than two layers, usually 4 to 16 layers or more. The exact features and specifications of a multilayer FR4 TG180 PCB will depend on the manufacturer, but some common features may include:

Multilayer Count: Multilayer FR4 TG180 PCBs typically have more layers than single or two-layer PCBs, adding functionality and complexity.

High Heat Resistance: FR4 TG180 material has high heat resistance and is suitable for high temperature applications.

Tighter impedance control: Multilayer FR4 TG180 PCBs can have tighter impedance control, which is especially important for high-speed digital and RF applications.

High-frequency performance: FR4 TG180 material has good high-frequency performance and is suitable for occasions requiring high-speed signal transmission.

Smaller via sizes: Multilayer FR4 TG180 PCBs can use smaller via sizes, increasing density and reducing signal interference.

Overall, the multilayer FR4 TG180 PCB is a high performance PCB suitable for a wide range of applications where high temperature, high speed signal transmission and impedance control are important.

PCB Layer Multilayer Printed Circuit board(12L)
PCB surface finished Immersion gold 2u" (0.05 - 0.1 µm gold over 3 - 5 µm of Nickel.) and gold finger
PCB material requirement FR4, TG180
PCB thickness finished 2.2mm finished, +/-10%
Smallest hole size 0.20mm
PCB solder resist 2 sides, blue
PCB silkscreen color 2 sides, white
Copper weigh of outer layer 1 oz (35µm) Finished Copper Weight
Copper weigh of inner layer 1/2 oz (18µm) Base Weight
Special requirements Copper filled vias and supplied stack-up

Shenzhen Jieteng Circuit Co., Ltd.

Professional rapid proofing and multi-variety batch expedited PCB circuit boards

FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

Product tags

nickel plating pcb

,

copper plating pcb

,

copper plating in pcb
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FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

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Product Detail
Brand Name :
JIETENG
Model Number :
FR4
Certification :
ISO/TS16949/RoHS/TS16949
Place of Origin :
china
MOQ :
Negotiable
Price :
Negotiable
Contact Supplier
FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

ShenZhen Jieteng Circuit Co., Ltd.

Verified Supplier
3 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Other
Main Products :
SMT PCB Board, FR4 PCB Board, High Frequency PCBs
Total Annual :
500000-600000
Employee Number :
200~300
Certification Level :
Verified Supplier
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