K9F4G08U0D-SIB0 Samsung Chip Component Assembled

Detail Information:

1, Part Name: Chip Component

2, Model:K9F4G08U0D-SIB0

3, Brand: Samsung

4, Condition: Original New

5, Origin: Korean

• Manufacturer Part Number:

  K9F4G08U0D-SIB0000

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  12 X 20 MM, 0.50 MM PITCH, HALOGEN AND LEAD FREE, PLASTIC, TSOP1-48

• Manufacturer:

  Samsung Semiconductor

• Risk Rank:

  5.84

• Access Time-Max:

  25 ns

• Command User Interface:

  YES

• Data Polling:

  NO

• JESD-30 Code:

  R-PDSO-G48

• Length:

  18.4 mm

• Memory Density:

  4294967296 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Sectors/Size:

  4K

• Number of Terminals:

  48

• Number of Words:

  536870912 words

• Number of Words Code:

  512000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  512MX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSOP1

• Package Equivalence Code:

  TSSOP48,.8,20

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE

• Page Size:

  2K words

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Power Supplies:

  3/3.3 V

• Programming Voltage:

  3.3 V

• Qualification Status:

  Not Qualified

• Ready/Busy:

  YES

• Seated Height-Max:

  1.2 mm

• Sector Size:

  128K

• Standby Current-Max:

  0.00005 A

• Subcategory:

  Flash Memories

• Supply Current-Max:

  0.03 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Toggle Bit:

  NO

• Type:

  NAND TYPE

• Width:

  12 mm