Introduction of 3W UV laser marking machine

3W UV laser marking machine is developed by using 355nm UV laser. Compared with infrared laser, 355 UV laser focus spot is very small. The marking effect is that the short wavelength laser directly interrupts the molecular chain of materials, which greatly reduces the mechanical deformation of materials. Although the thermal deformation is cold light, it is mainly used for ultra-fine marking It is especially suitable for food and medicine packaging materials marking, microporous, glass, porcelain material high-speed division and complex pattern cutting of silicon wafer.
Characteristics of 3W UV laser marking machine
1. Due to the small focusing spot and small heat affected zone, UV laser can be used for ultra-fine marking, which is the first choice for customers with higher requirements on marking effect;
2. In addition to copper, UV laser has more suitable materials for processing;
3. Not only the beam quality is good, but also the focusing spot is smaller, which can realize hyperfine labeling;
4. The application range is more extensive; the heat affected area is very small, which will not produce thermal effect and material burning problem;
5. It has the advantages of fast marking speed, high efficiency, stable performance, small size and low power consumption;

Application of 3W UV laser marking machine
1. Suitable for glass (laser engraving machine for glassware), polymer materials and other objects surface marking, micro hole processing;
2. It is widely used for marking the surface of packaging bottles (boxes) of food, medicine, cosmetics, wires and other polymer materials;
3. Flexible PCB, LCD, TFT marking, dicing and cutting, etc;
4. Removal of metallic or non-metallic coatings;
5. Micro hole and blind hole processing of silicon wafer;