Solder Paste Inspection Machine(SPI)-Inspection Machines,SMTfly-V700​ Specification:

Solder Paste Inspection Machine(SPI)-Inspection Machines,SMTfly-V700​ Features:

Red glue detection

This device, in addition to supporting common 3D solder paste inspection, can also detect red rubber process at the same time, supporting missed printing, overflowing plastics, multiple adhesives, and low adhesives, etc., and displaying full-color defective image. Positioning.

Bare-board learning programming

No Gerber and CAD files are required, as long as a bare board is provided, automatic learning programming can be realized. The software automatically extracts the detection frame data, and the user edits it appropriately, and sets detection parameters and allowable values.

Automatic plate bend compensation

The three-dimensional plate bending compensation technique is used to perform surface fitting on the discrete reference points in the FOV to perform real-time compensation during the detection process. There is no need to move the Z axis and the detection speed is faster.

Camera bar code recognition

The camera can automatically identify the bar code (one-dimensional/two-dimensional) of the inspection surface on the PCB to facilitate trace ability of product quality.

Offline programming and debugging

The remote programming can be done by using offline programming software to import Gerger, CAD, etc. The programming time does not exceed 5 minutes.

Detection frame can be adjusted at any time

The size and shape of openings in some gerber files may not be exactly the same as openings in the stencil. In this case, the data (position, size, shape, etc.) of the detection frame can be manually adjusted through the learning mode.