Flexiable Printed Circuit PCB Depanelizer with Laser Scanning Speed 2500mm/s,SMTfly-5L

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws:

Damages and fractures to substrates and circuits due to mechanical stress,

Damages to PCB due to accumulated debris,

Constant need for new bits, custom dies, and blades,

Lack of versatility – each new application requires ordering of custom tools, blades, and dies,

Not good for high precision, multi-dimensional or complicated cuts,

Not useful PCB depaneling/singulation smaller boards,

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

Advantages of Laser PCB depaneling/singulation:

No mechanical stress on substrates or circuits

No tooling cost or consumables.

Versatility – ability to change applications by simply changing settings

Fiducial Recognition – more precise and clean cut

Optical Recognition before PCB depaneling/singulation process begins.

Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

Extraordinary cut quality holding tolerances as small as < 50 microns.

No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards.

Flexiable Printed Circuit PCB Depanelizer-Laser PCB Depaneling Machine Features:

• Pre-camera vision product position registration and model check
• Coherent Avia NX UV laser with HurrySCAN head
• High capacity BOFA dust collector
• User friendly Window based software
• PCB flexible product jig adjustable for different board size
• High resolution and accurate Z stage with auto-focus function
• Large area low friction front loading platform for sliding multiple product jigs
• Fully covered class 1 safety enclosure
• Able to do cutting and marking together
• Compact size

Working Principle :

humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )

FPC Laser Cutting Machine For PCB Separator Specification:

Part of PCB UV Laser Separating-PCB Separator Machine: