Heat Pulse PCB Hot Bar Soldering Machine for FPC HSC FFC to PCB,SMTfly-PP1S Features:
Heat Pulse PCB Hot Bar Soldering Machine for FPC HSC FFC to PCB Specification:
Size | 500mm X 750mm X 910mm |
Work Air Pressure | 0.5-0.7MPA |
Working Area | 110mm X 150mm |
Temperature setup | 0-400℃ |
Tolerance of Temp | +2° |
Time of pressing | 0-99s |
Tolerance of Pressing | 0.05MPA |
Heat Pulse PCB Hot Bar Soldering Machine for FPC HSC FFC to PCB Application:
Apply to the hot-pressing/welding/soldering for high density HSC to LCD or PCB etc
use constant temperature to hot pressing
1. mainly apply to the hot-pressing/welding/soldering for high density HSC to LCD or PCB etc,
2. use constant temperature to hot pressing.
Sample for Hotbar Bonding Machine: