3D SPI-Advanced 3D Solder Paste Inspection System SPI,SMTfly-V700 Specification:
Mechanical System | PCB Transfer System | Substrate fixing method: bottom-up fixing; automatic access plate and automatic width adjustment system, conforming to SMEMA standard; track height: 900±20mm | |
PCB size | 25mm*60mm~250mm*300mm (Customized) | ||
PCB thickness | 0.3mm~3mm | ||
Plate bending compensation | <1mm | ||
X, Y Platform | Drive Equipment |
AC Servo Motor System |
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Positioning accuracy | <1μm | ||
Travel speed | 700mm/s | ||
Control System | Computer Host | Industrial Control Computer: Intel High-end quad-core CPU, 8GDDR memory, 1T hard disk | |
Display output | 19-inch widescreen LCD monitor | ||
Other parameters | Mechanical dimensions (length * width * height) | 82cm*65cm*76cm | |
Weight | 75 kg | ||
Power | AC220V±10%, 50/60Hz, 450W | ||
Air source | 4-6bar | ||
Working environment Temperature | 10-40°C, Humidity 30-80%RH |
3D SPI-Advanced 3D Solder Paste Inspection System SPI,SMTfly-V700 Features:
Red glue detection
This device, in addition to supporting common 3D solder paste inspection, can also detect red rubber process at the same time, supporting missed printing, overflowing plastics, multiple adhesives, and low adhesives, etc., and displaying full-color defective image. Positioning.
Bare-board learning programming
No Gerber and CAD files are required, as long as a bare board is provided, automatic learning programming can be realized. The software automatically extracts the detection frame data, and the user edits it appropriately, and sets detection parameters and allowable values.
Automatic plate bend compensation
The three-dimensional plate bending compensation technique is used to perform surface fitting on the discrete reference points in the FOV to perform real-time compensation during the detection process. There is no need to move the Z axis and the detection speed is faster.
Camera bar code recognition
The camera can automatically identify the bar code (one-dimensional/two-dimensional) of the inspection surface on the PCB to facilitate trace ability of product quality.
Offline programming and debugging
The remote programming can be done by using offline programming software to import Gerger, CAD, etc. The programming time does not exceed 5 minutes.
Detection frame can be adjusted at any time
The size and shape of openings in some gerber files may not be exactly the same as openings in the stencil. In this case, the data (position, size, shape, etc.) of the detection frame can be manually adjusted through the learning mode.