TFT LCD Assembly/ Repair Bonder
1、The definition of TFT LCD Assembly/ Repair Bonder equipment XCM71-A6:
TFT LCD Assembly/ Repair Bonder equipment referred to as "state machine equipment" "hot press," using heat pipe and pulse to heat , mainly applicable to capacitive touch screen (CTP), LCD module production and maintenance processes FPC, COF, TAB bonding combination with the LCD and PCB after attached a ACF. use head pressure, head temperature, bonding time, optical alignment system bonding with LCD FPC, ACF glue which is between the PCB so that it can conduct.
5、About the basic parameters of TFT LCD Assembly/ Repair Bonder equipment XCM71 -A6
Input Power: AC220V 50-60Hz
Working pressure :0.4-0 .8 Mpa
Operating modes: 7-inch HMI
Dimensions: L2210 × W1730 × H1500 mm
The method of Heating: heating or pulse heating thermostat
The quantity of Fixture: 2 group X-Y-θ micrometer adjustable
Range of Temperature : RT-500
Control program: PLC controller
Body main material: Steel + baking varnish
The thermocouple: K type