5.5 INCH TOUCH PCAP TFT MIPI INTERFACE PRODUCT INTRODUCTION
Features
Item | Specification | Unit |
Screen Size | 5.5 | inch |
Number of Pixel | 1080*3RGB(H)X1920(V) | Pixels |
Display area | 68.04(H) * 120.96(V) | mm |
Pixel pitch | 0.021(H) *0.063(V) | mm |
Outline Dimension | 75.8(W) ×139.9(H) ×3.49(T) | mm |
Pixel arrangement | RGB Vertical Stripe | ― |
Display mode | Normally Black | ― |
Viewing Direction(eye) | ALL | ― |
Display Color | 262K | ― |
Luminance(cd/m2) | 1100 | nits |
Contrast Ratio | 800:1 | ― |
Interface | MIPI | |
Back-light | LED Side-light type | ― |
LCM IC | HX8399C | |
CTP IC | GT911 | |
Operation Temperature | -20~60 | ℃ |
Storage Temperature | -30~70 | ℃ |
Outline Drawing
Module Function Description
Pin No | Symbol | Description |
1 | GND | Power Ground |
2 | GND | Power Ground |
3 | CTP_RST | Touch panel reset |
4 | RESET | Reset signal input terminal. Active at ‘L’. |
5 | CTP_INT | Touch panel interrupt output |
6 | TE | Tearing effect signal is used to synchronize MCU to frame memory |
7 | CTP_SDA | Touch panel I2C data |
8 | LCD_ID | Not connected |
9 | CTP_SCL | Touch panel I2C clock |
10 | GND | Power Ground |
11 | CTP_VCC | Touch panel Power supply 2.8~3.3V |
12 | D0N | High speed interface data differential signal input/output pins |
13 | GND | Power Ground |
14 | D0P | High speed interface data differential signal input/output pins |
15 | LEDA | Power supply for backlight anode input terminal. |
16 | GND | Power Ground |
17 | LEDA | Power supply for backlight anode input terminal. |
18 | D1N | High speed interface data differential signal input/output pins |
19 | GND | Power Ground |
20 | D1P | High speed interface data differential signal input/output pins |
21 | LEDK | Power supply for backlight cathode input terminal. |
22 | GND | Power Ground |
23 | LEDK | Power supply for backlight cathode input terminal. |
24 | CLKN | High speed interface clock differential signal input/output pins |
25 | LEDK | Power supply for backlight cathode input terminal. |
26 | CLKP | High speed interface clock differential signal input/output pins |
27 | GND | Power Ground |
28 | GND | Power Ground |
29 | PWM | This pin is connecting with the external LED driver. |
30 | D2N | High speed interface data differential signal input/output pins |
31 | IOVCC 1.8V | Power Supply For I/O. |
32 | D2P | High speed interface data differential signal input/output pins |
33 | GND | Power Ground |
34 | GND | Power Ground |
35 | VSP | External input voltage(4.8V~6V) |
36 | D3N | High speed interface data differential signal input/output pins |
37 | VSN | External input voltage(-4.8V~-6V) |
38 | D3P | High speed interface data differential signal input/output pins |
39 | GND | Power Ground |
40 | GND | Power Ground |
Absolute Maximum Rating
Characteristics | Symbol | Min. | Max. | Unit |
LCM Operating Temperature | TOPR | -20 | +60 | °C |
LCM Storage Temperature | TSTG | -30 | +70 | °C |
TP Operating Temperature & Humidity(20% ~ 90%RH) | TOPR | -20 | +60 | °C |
TP SStorage Temperature & Humidity(20% ~ 90%RH) | TSTG | -30 | +70 | °C |
Humidity | RH | - | 90 | % |
TFT DC Characteristics
Characteristics | Symbol | Min. | Typ. | Max. | Unit | Note |
Supply Voltage for I/O | VDDIO | 1.65 | 1.8 | 3.3 | V | |
External Input Voltage for(DC/DC) | VSP | 4.8 | -- | 6.0 | V | |
External Input Voltage for(DC/DC) | VSN | -6.0 | -- | -4.8 | V |
Back-Light Unit Characeristics
The back-light system is an edge-lighting type with 15 white LEDs. The characteristics of the back-light are shown in the following tables.
Characteristics | Symbol | Min. | Type | Max. | Unit | Notes |
Forward Voltage | VF | 28 | -- | 32 | V | - |
Forward current | IF | -- | 60 | - | mA | - |
Luminance(With LCD+CTP) | Lv | -- | 1200 | -- | cd/m2 | - |
LED life time | N/A | ---- | 30,000 | -- | Hr | Note 1 |
Note:
Reliability Test Item
No. | Test Item | Test Condition | Notes |
1 | High Temp. Storage | +70°C / 96H | 1. Functional test isOK. Missing Segment,short, unclear segment non-display,display abnormally and liquid crystal leakare un-allowed. 2. No low temperature bubbles,end seal loose andfall, frame rainbow. |
2 | Low Temp. Storage | -30°C / 96H | |
3 | High Tempe. Operating | +60°C / 96H | |
4 | Low Tempe. Operating | -20°C / 96H | |
5 | High Temperature /Humidity storage | 50°C x 90%RH /96H | |
6 | Thermal and cold shock | Static state, -20℃(30min) ~60℃ (30min),10 cycles |
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