Unleash the Potential of FPC Board Production with LDI Laser Direct Imaging Machine
The possibilities are endless. Invest in an LDI laser direct imaging machine for your FPC board production to make it more efficient, precise, and reliable!
In the previous article, we discussed the use of LDI laser direct imaging technology in FPC (Flexible Printed Circuit) board manufacturing. Now, let's delve into the integration of roll-to-roll exposure machines to further enhance the automation of the process.
Since FPC boards are flexible, roll-to-roll automated LDI exposure mode can be utilized. This combination of roll-to-roll technology and LDI laser direct imaging offers significant advantages, such as increased efficiency and accuracy in FPC board production.
Roll-to-roll technology involves processing materials on continuous rolls, making it suitable for large-scale production. In FPC board manufacturing, roll-to-roll automated LDI exposure machines enable continuous exposure by feeding the flexible boards from a roll into the exposure area using an automated feeding system. The exposure area is equipped with a high-precision alignment system to ensure accurate laser alignment. Once alignment calibration is complete, the exposure process starts automatically.
LDI laser direct imaging machines utilize laser beams emitted by laser sources. These beams are focused through an optical system and directed onto specific positions on the flexible boards for exposure. Due to the nature of roll-to-roll processing, the flexible boards continuously pass through the exposure area, enabling a continuous exposure process. This continuous exposure method significantly improves production efficiency, reducing time and steps involved in the imaging process.
After exposure, the flexible boards undergo subsequent processes such as development, etching, and copper plating to form the circuit patterns of FPC boards. In roll-to-roll automated LDI exposure machines, these subsequent processes can be seamlessly integrated with the exposure process, enabling a fully automated production flow.
Roll-to-roll automated LDI exposure machines offer numerous advantages in FPC board manufacturing. Firstly, they greatly enhance production efficiency, reducing time and labor costs involved in the imaging process. Secondly, the high precision and resolution of LDI laser direct imaging machines allow for the creation of more accurate circuit patterns. Additionally, the automated roll-to-roll process reduces the risk of human errors and manufacturing defects, enhancing the reliability of the products.
Investing in roll-to-roll automated LDI exposure machines is a wise choice to take your FPC board production to new heights. Contact us now to learn more about roll-to-roll automated LDI exposure machines and how they can revolutionize your manufacturing process. Experience the power of roll-to-roll exposure imaging and unlock infinite possibilities for your FPC board production. Invest in roll-to-roll automated LDI exposure machines for a more efficient, precise, and reliable FPC board production!
Unleash the Potential of FPC Board Production with LDI Laser Direct Imaging Machine
The possibilities are endless. Invest in an LDI laser direct imaging machine for your FPC board production to make it more efficient, precise, and reliable!
When it comes to exposure technology in FPC (Flexible Printed Circuit) manufacturing, the roll-to-roll automated LDI (Laser Direct Imaging) exposure mode is a highly useful solution. It combines the advantages of roll-to-roll technology and LDI laser direct imaging to bring higher efficiency and accuracy to FPC board production.
Roll-to-roll technology involves processing materials on continuous rolls, making it suitable for large-scale production. In FPC board manufacturing, the roll-to-roll automated LDI exposure machine allows for continuous exposure by continuously feeding the flexible boards from a roll into the exposure area using an automated feeding system. The exposure area is equipped with a high-precision alignment system to ensure accurate laser alignment. Once the alignment calibration is complete, the exposure process starts automatically.
LDI laser direct imaging machines use laser beams emitted by laser sources. These beams are focused through an optical system and directed onto specific positions on the flexible boards for exposure. Due to the roll-to-roll nature of the process, the flexible boards continuously pass through the exposure area, enabling a continuous exposure process. This continuous exposure method greatly improves production efficiency, reducing time and steps involved in the imaging process.
After exposure, the flexible boards undergo subsequent processes such as development, etching, and copper plating to form the circuit patterns of FPC boards. In roll-to-roll automated LDI exposure machines, these subsequent processes can be seamlessly integrated with the exposure process, enabling a fully automated production flow.
Roll-to-roll automated LDI exposure machines offer numerous advantages in FPC board manufacturing. Firstly, they greatly enhance production efficiency, reducing time and labor costs involved in the imaging process. Secondly, the high precision and resolution of LDI laser direct imaging machines allow for the creation of more accurate circuit patterns. Additionally, the automated roll-to-roll process reduces the risk of human errors and manufacturing defects, enhancing the reliability of the products.
Investing in roll-to-roll automated LDI exposure machines is a wise choice to take your FPC board production to new heights. Contact us now to learn more about roll-to-roll automated LDI exposure machines and how they can revolutionize your manufacturing process. Experience the power of roll-to-roll exposure imaging and unlock infinite possibilities for your FPC board production. Invest in roll-to-roll automated LDI exposure machines for a more efficient, precise, and reliable FPC board production!
Specification/model | RTR315 |
Application | PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
Resolution (mass production) | 20um |
Capacity | 12S@18"*24" |
Exposure Size | 260*800mm |
Panel thickness | 0.05mm-3.5mm |
Alignment Mode | UV-Mark |
Alignment capability | Outer layer±10um; |
Line width tolerance | ±10% |
Deviation increase and decrease mode | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
Laser type | LD Laser,405±5nm |
File format | Gerber 274X;ODB++ |
Power | 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
Condition | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.