Specifications
Brand Name :
GIS Laser
Model Number :
DPX230
Place of Origin :
Suzhou, China
High sensing dry film :
35s@24
Line width tolerance :
±10%
Text information :
Support The Board To Set Text And Serial Number And Other Traceable Information
Laser power :
405 Nm/25-50 W(optional)
Applicable process :
Inner, Outer, Ceramic Substrate
Technology raster :
Line Width/ Line Spacing 25/25μm
Application :
PCB、HDI、FPC
Inner alignment accuracy :
20μm
Description

Product Description:

The Laser Direct Imaging (LDI) Machine is an advanced imaging system that uses laser technology to directly transfer patterns onto a variety of substrates. This machine is equipped with a raster of 25/25μm line width and line spacing, offering the accuracy and versatility needed for both inner and outer imaging, as well as ceramic substrate processing. It also offers a wide range of laser powers from 25 to 50 W, with a standard of 405 Nm. The board thickness range of this machine is 0.05 to 7mm, with an outer alignment accuracy of ±10μm. Thanks to this LDI Machine, customers can now enjoy a cost-effective, high-quality imaging solution that is suitable for a variety of applications and substrates. This machine is not only reliable and highly precise, but also offers a fast and efficient imaging procedure.


Features:

  • Laser Direct Imaging Machine
  • Support The Board To Set Text And Serial Number And Other Traceable Information
  • Inner alignment accuracy: 20μm
  • Application: PCB、HDI、FPC
  • Splicing: Support Full Table Splicing Exposure
  • High sensing dry film: 35s@24
  • Laser Imaging Equipment
  • LDI Direct Printing
  • Laser Printing Device

Technical Parameters:

Feature Detail
LDI Print System Laser Direct Imaging
LDI Direct Imaging Laser Direct Printing
Splicing Support Full Table Splicing Exposure
Technology Raster Line Width/ Line Spacing 25/25μm
Text Information Support The Board To Set Text And Serial Number And Other Traceable Information
Application PCB、HDI、FPC
Effective Exposure Area 610mm*710mm
High Sensing Dry Film 35s@24
Applicable Process Inner, Outer, Ceramic Substrate
Outer Alignment Accuracy ±10μm
Scale Mode Fixed Scale/ Auto Scale/ Interval Scale/Partition Alignment
Board Thickness 0.05~7mm

Applications:

The GIS Laser DPX230 Laser Direct Imaging System is a versatile printing solution for a variety of applications. Featuring a laser power of 405 nm/25-50 W (optional) and an inner alignment accuracy of 20 μm, the system offers a line width/line spacing of 25/25 μm and a line width tolerance of ±10%. It also supports Gerber274x and ODB++ file formats, making it easy to create and transfer designs. With its reliable performance and advanced technology, the GIS Laser DPX230 is the ideal solution for precision laser direct printing.

The GIS Laser DPX230 is ideal for a variety of applications, such as circuit boards, printed circuit boards, medical device components, aerospace components, and automotive parts. It is also ideal for printing on plastics, metals, ceramics, and other materials. The system is capable of printing complex designs with high resolution and accuracy, making it the perfect choice for industries that need to produce intricate designs or require high precision. Additionally, the GIS Laser DPX230 is an affordable printing solution for small to medium production runs.

The GIS Laser DPX230 Laser Direct Imaging System is the perfect choice for any application that requires precision laser direct printing. With its reliable performance, advanced technology, and affordable price, the GIS Laser DPX230 is the ideal solution for any business or industry that needs to produce intricate designs or require high precision.


Customization:

GIS Laser DPX230 Laser Printing Device Customization
  • Brand Name: GIS Laser
  • Model Number: DPX230
  • Place of Origin: Suzhou, China
  • Outer alignment accuracy: ±10μm
  • Board thickness: 0.05~7mm
  • Scale mode: Fixed Scale/ Auto Scale/ Interval Scale/Partition Alignment
  • Splicing: Support Full Table Splicing Exposure
  • Application: PCB、HDI、FPC

GIS Laser DPX230 Laser Printing Device is a custom-made device for laser printing, which is designed to meet the needs of various industries. It is characterized by its high-precision outer alignment accuracy of ±10μm, board thickness of 0.05~7mm, various scale modes, such as Fixed Scale/ Auto Scale/ Interval Scale/Partition Alignment, and full table splicing exposure. It is suitable for PCB、HDI、FPC and other industries.


Support and Services:

Laser Direct Imaging Machine provides technical support and services to ensure seamless operation of the product. Technical support is available 24/7 and includes:

  • Troubleshooting
  • Product updates
  • Software and hardware installation
  • Remote access to the product
  • Customer service and support
  • Technical guidance and advice
  • Warranty service

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Flexible Scale Mode Laser Direct Imaging Machine for Interval Scale PCB Manufacturing

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Brand Name :
GIS Laser
Model Number :
DPX230
Place of Origin :
Suzhou, China
High sensing dry film :
35s@24
Line width tolerance :
±10%
Text information :
Support The Board To Set Text And Serial Number And Other Traceable Information
Contact Supplier
Flexible Scale Mode Laser Direct Imaging Machine for Interval Scale PCB Manufacturing
Flexible Scale Mode Laser Direct Imaging Machine for Interval Scale PCB Manufacturing
Flexible Scale Mode Laser Direct Imaging Machine for Interval Scale PCB Manufacturing

Jiangsu GIS Laser Technologies Inc.,

Verified Supplier
5 Years
suzhou
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Other
Total Annual :
>1000000
Employee Number :
>100
Certification Level :
Verified Supplier
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