Specifications
Brand Name :
GIS
Model Number :
DPX230
Certification :
ISO 9001 CE
Place of Origin :
Jiangsu, China
MOQ :
1 set
Price :
negotiable price
Supply Ability :
30set per month
Delivery Time :
20 work days
Packaging Details :
wooden case packing
Name :
laser Direct Imaging (LDI)
Application :
PCB HDI FPC
Exposure Size Max :
610*710mm
Line Width :
30μ
Line Line Distance :
10%
Line Width tolerance :
10%
Alignment Capability :
24μm
Laser Type :
LD Laser, 405±5nm
Efficient :
30-40S@18"*24"
Deviation increase and decrease :
Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment
File Format :
Gerber 274X, ODB++
Description

laser direct imaging (LDI) system solutions HDI PCB

Technical advantages of LDI

(1) LDI technology adopts laser positioning and vertical laser beam scanning, which can ensure that the graphic position deviation is within ± 5um, which greatly improves the line alignment accuracy and position.

(2) LDI technology does not use negative film, which can meet the production of very high-density fine conductors, improve the qualification rate of fine line PCB manufacturing and avoid repeated positioning defects.

(3) LDI technology does not need to manufacture, preserve and maintain photographic film devices, consumed materials, energy, other auxiliary materials, and chemicals, which reduces the production and processing cost.

(4) LDI technology can shorten the PCB manufacturing process, reduce the turnaround time, improve the rapid response-ability, reduce the intervention of human factors, simplify the operation process, and then improve the production efficiency.


How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

Specification/model DPX230
Application PCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production) 30um
Capacity 30-40S@18"*24"
Exposure Size 610*710mm
Panel thickness 0.05mm-3.5mm
Alignment Mode UV-Mark
Alignment capability Outer layer±12um;Inner laye±24um
Line width tolerance ±10%
Deviation increase and decrease mode Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser type LD Laser,405±5nm
File format Gerber 274X;ODB++
Power 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10%
Condition Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

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LD Laser LDI System 400nm To 410nm 380V Three Phase

Ask Latest Price
Brand Name :
GIS
Model Number :
DPX230
Certification :
ISO 9001 CE
Place of Origin :
Jiangsu, China
MOQ :
1 set
Price :
negotiable price
Contact Supplier
LD Laser LDI System 400nm To 410nm 380V Three Phase
LD Laser LDI System 400nm To 410nm 380V Three Phase
LD Laser LDI System 400nm To 410nm 380V Three Phase
LD Laser LDI System 400nm To 410nm 380V Three Phase
LD Laser LDI System 400nm To 410nm 380V Three Phase

Jiangsu GIS Laser Technologies Inc.,

Verified Supplier
5 Years
suzhou
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Other
Total Annual :
>1000000
Employee Number :
>100
Certification Level :
Verified Supplier
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