Specifications
Brand Name :
GIS
Model Number :
DPX630SM
Certification :
ISO 9001 CE
Place of Origin :
Jiangsu, China
MOQ :
1 set
Price :
negotiable price
Supply Ability :
30set per month
Delivery Time :
20 work days
Packaging Details :
wooden case packing
Name :
laser Direct Imaging (LDI)
Application :
PCB HDI FPC
Exposure Size Max :
610*710mm
Line Width :
50μm
Line Line Distance :
50μm
Line Width tolerance :
10%
Laser Type :
LD Laser, 405±5nm
Deviation increase and decrease :
Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment
File Format :
Gerber 274X, ODB++
Description

laser direct imaging (LDI) system solutions PCB Solder Mask


PCB laser direct imaging (LDI)

when it comes to a prototype circuit board, PCB layout is one of the most important aspects. taking into account the smallest things goes wrong, the entire board will be damaged and it will not function appropriately, so PCB layout is extremely important. The imaging process, one of the most important steps in the PCB assembly process, and it does well in creating the PCB pattern.

For engineers, laser direct imaging ( LDI ) can make a good effect on creating an imaging pattern on laminates in a streamlined process. The laminates of a PCB are fabricated by curing with thermosetting resin under the pressure and temperature layers of cloth or paper to form an integral final piece of uniform thickness. Now PCBGOGO will explain about laser direct imaging ( LDI ) for flexible circuits.

How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

Specification/model DPX230
Application PCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production) 30um
Capacity 30-40S@18"*24"
Exposure Size 610*710mm
Panel thickness 0.05mm-3.5mm
Alignment Mode UV-Mark
Alignment capability Outer layer±12um;Inner laye±24um
Line width tolerance ±10%
Deviation increase and decrease mode Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser type LD Laser,405±5nm
File format Gerber 274X;ODB++
Power 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10%
Condition Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

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380V Three Phase Laser Direct Imaging PCB HDI FPC

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Brand Name :
GIS
Model Number :
DPX630SM
Certification :
ISO 9001 CE
Place of Origin :
Jiangsu, China
MOQ :
1 set
Price :
negotiable price
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380V Three Phase Laser Direct Imaging PCB HDI FPC

Jiangsu GIS Laser Technologies Inc.,

Verified Supplier
5 Years
suzhou
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Other
Total Annual :
>1000000
Employee Number :
>100
Certification Level :
Verified Supplier
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