Specifications
Brand Name :
GIS
Model Number :
DPX230
Certification :
ISO 9001 CE
Place of Origin :
Jiangsu, China
MOQ :
1 set
Price :
negotiable price
Supply Ability :
30set per month
Delivery Time :
20 work days
Packaging Details :
wooden case packing
Name :
laser Direct Imaging (LDI)
Application :
PCB HDI FPC
Exposure Size Max :
610*710mm
Line Width :
30μ
Line Line Distance :
10%
Line Width tolerance :
10%
Alignment Capability :
24μm
Laser Type :
LD Laser, 405±5nm
Efficient :
30-40S@18"*24"
Deviation increase and decrease :
Fixed increase and contracton, automatic increase and contraction, interval increase and contraction, partition alignment
File Format :
Gerber 274X, ODB++
Description

laser direct imaging (LDI) system solutions for various PCB

Function:

Multiple options for expansion

and contraction function

1. automatic expansion and contraction function

2. fixed expansion function:

Exposure based on the fixed expansion values provided

3. measurement function:

The actual measurement of the plate select the actual plate expansion value for exposure

Job description: can set the number of plates to be measured, after measuring the plate to take

The average value is exposed.

Super-long optical focal depth and light

source power monitoring function:

Ultra-long focal depth ±300μm;

Real-time monitoring and dynamic adjustment of laser energy during work

Tracing back

Serial number| Running number | expansion and contraction value | Date | Time | Bar code | QR code |

LDI Process: total 5 minutes (CAM Data Output & Ready Print).

· No more mask concerns

· High yield and throughput

· Flexible irregular substrat


How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

Specification/model DPX230
Application PCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production) 30um
Capacity 30-40S@18"*24"
Exposure Size 610*710mm
Panel thickness 0.05mm-3.5mm
Alignment Mode UV-Mark
Alignment capability Outer layer±12um;Inner laye±24um
Line width tolerance ±10%
Deviation increase and decrease mode Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser type LD Laser,405±5nm
File format Gerber 274X;ODB++
Power 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10%
Condition Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

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380V Laser Direct Imaging Equipment PCB 610x710mm

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Brand Name :
GIS
Model Number :
DPX230
Certification :
ISO 9001 CE
Place of Origin :
Jiangsu, China
MOQ :
1 set
Price :
negotiable price
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380V Laser Direct Imaging Equipment  PCB 610x710mm

Jiangsu GIS Laser Technologies Inc.,

Verified Supplier
5 Years
suzhou
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Other
Total Annual :
>1000000
Employee Number :
>100
Certification Level :
Verified Supplier
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