laser direct imaging (LDI) system solutions for various PCB Multilayer

When Opt to LDI Technology?

Existing technologies are unable to offer acceptable solution and the inevitable results is reduced PCB production efficiency and lower yields. Nowadays, an average PCB trace width reaches 0.075mm (3mil) in complex multilayer PCBs. While photolithography imaging process unfortunately reached its limits due to creating high density interconnects on PCB. It is unable to creating PCB below 0.127/0.127mm (5/5mil) of trace widths and spaces. So, when most of the trace widths and spaces on a circuit board are smaller than 0.127/0.127mm (5/5mil), LDI is the best imaging option.

LDI technology is mainly used in HDI board manufacturing before. But now PCB manufacturers have to manufacture fine-line and ultra-fine-line conventional rigid, flex and rigid-flex PCBs with LDI technology where the trace widths and spaces of the conductive circuits are 0.075/0.075mm (3/3mil) or even 0.05/0.05mm (2/2mil). That’s because Laser Direct Imaging (LDI) has proved itself as the best and most comprehensive imaging solution for fine trace widths and spaces.

How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.