6 Zone Lead Free Reflow Oven SMT Assembly Machine OEM Available
Lead Free Reflow Oven 6 Zone SMT Assembly Machine for Production Line
Specifications
Model | RF-600I |
Conveyor Height | 900± 20 MM |
Conveyor Direction | Option |
Length of Heating Zones | 2600 MM |
Nozzle Plate | Stainless Steel Plate |
Temperature Control Precision | ± 1C |
Convryor Speed | 20-2000MM/min |
Max. Width of PCB | 50 ~ 400 MM |
Cooling Method | Air Oven : Forced Air; Nitrogen Oven : Water Chiller |
Components Clearance | Top / Bottom Clearance of PCB is 25mm |
Temp. Setting Range | Rome Temperature ~320C |
No. of Cooling Zones | 1 |
PCB Conveyor Method | Mesh and Rails |
Mesh Width | 450 MM |
Normal Operation Power | About 5KW |
Dimension ( L*W*H ) | 4500*1300*1450 |
Weight | 1500KG |
Startup Power | Approx. 27KW |
Power Supply | 380V 50HZ / 220V 60HZ |
Temperature Deviation on PCB | ± 1.5C |
No. of Heating Zones | Top 6 & Bottom 6 |
ProductT Performance of Reflow Oven
Windows XP Windows operating interface, design two con-trol modes. Computer control and emergency manual con-trol, security fuction.
The temperature zone adopts the forced independent circu-lation. independent PID control,. independent heating madeup and down, the turnace cavity temperature can beaccu-rate, even, large heat capacity, tenperature control and highcurve repeatavility. Bult-in air-cooled zone, double-side cool-ing. excellent cooling eftect
Bult-in temperature curvetestfunction, specializinginhigh-and digtal products.
Circuit board of high dificulty welding.
Configure the guide network converyor system.
Rosin recyclng system. system.90% recovery rate. changeand clean is very convenience.
Information of Reflow Oven
Vapour phase oven
The heating of the PCBs is sourced by thermal energy emitted by the phase transition of a heat transfer liquid (e. g. PFPE) condensing on the PCBs. The liquid used is chosen with a desired boiling point in mind to suit the solder alloy to be reflowed.
Some advantages of vapour phase soldering are:
High energy efficiency due to the high heat transfer coefficient of vapour phase media
Soldering is oxygen-free. There is no need for any protective gas (e.g. nitrogen)
No overheating of assemblies. The maximum temperature assemblies can reach is limited by the boiling point of the medium.
This is also known as condensation soldering.
FAQ
Q1: What's your main prodducts ?
We can produce wave solder machine, reflow oven, PCB loader unloader, Laser marking machine, PCB conveyor, solder paste printer, selective soldering machine, etc. We specializes in wave solder and reflow oven equipement.
Q2 : What's the warranty of your products ?
Generally, we have one year warranty. If there is a problem with the accessory, we will provide it to u for free.
Q3 : If we don't know how to operate machine, what u can do for us ?
We can show u the solution at pictures with writing. If necessary, we will give u the video to introduce.
Try our best to let u understand and get it !