As component sizes shrink, printed circuit board manufacturers have adapted to changing trends. Make the PCB smaller, higher density, more components, and faster. The birth of HDI solves this problem very well. High-density interconnected PCB circuit boards, blind hole plating, and second-time pressing are all HDI boards, which are divided into first-order, second-order, third-order, fourth-order, and fifth-order HDI. The high-density interconnect PCB circuit board is a relatively high line distribution density of the circuit board using microblind and buried via technology. High-density interconnection HDI is just a PCB circuit board with more interconnections and occupying the smallest space.