There are several unique considerations to bear in mind when designing, assembling and manufacturing LED PCBs. Chief among these is often thermal management.

Most surface-mounted light-emitting diodes are relatively cool-running semiconductors. However, more powerful lighting arrays often feature multiple high-intensity LEDs arranged in close proximity on a single board. These sorts of designs can output significant heat over a relatively short space of time, which needs to be dissipated effectively in order to improve the overall performance, reliability and durability of the circuit and its components.

There are a number of ways to improve heat management when prototyping and assembling LED PCBs; smart design and precision prototyping are always the first steps. However, more densely packed circuits may require the use of additional components and manufacturing techniques – such as heat sinks or metallic board substrates – in order to improve dissipation.