52-Layer Flexible Printed Wiring Board Smd/Bga/Dip Components 0.1Mm Trace/Space Bend Radius 0.5-10Mm
The Rigid Flex PCB product represents the pinnacle of hybrid circuit board technology, merging the versatility of Flexible Stiff Circuit Boards with the robustness of traditional rigid PCBs. This unique combination allows for a design that can be tailored to fit spatial constraints while maintaining the integrity required for demanding applications. Comprised of multiple layers that include both rigid and flexible substrates, these boards are interconnected to form a single, integrated unit that offers superior electrical performance and mechanical reliability.
At the heart of the Rigid Flex Printed Wiring Board design are various components that can be mounted to suit diverse needs. These include Surface-Mounted Devices (SMDs), which are essential for modern, compact electronics. Ball Grid Arrays (BGAs) are also available for high-density integrations, which demand a large number of interconnects within a small footprint. Additionally, for applications that still require through-hole technology, Dual In-line Package (DIP) components can be incorporated. This versatile approach to component integration ensures that the Rigid Flex PCB product is suitable for a wide range of applications, from aerospace to consumer electronics.
As a PCB Assembly product, meticulous attention to detail is given to the assembly process. Utilizing advanced techniques and equipment, the Rigid Flex PCB is assembled with precision and care to ensure high-quality interconnectivity and functionality. The product type is characterized by its adaptability and can be customized to meet specific customer requirements, ensuring that each assembly is optimized for its intended application.
The profiling punching of the Rigid Flex PCB is achieved through various methods, including Routing, V-CUT, and Beveling. Routing is used to precisely shape the PCB to the desired outline. V-CUT is utilized to create a perforated line that facilitates the separation of the board's individual units, while Beveling is applied to the edges of the board to prepare them for smooth insertion into connectors. These profiling techniques enhance the overall quality and functionality of the Rigid Flex PCB, ensuring a perfect fit within the device architecture.
Treatment of the Rigid Flex PCB surfaces is another critical aspect of its manufacture. Options such as Electroless Nickel Immersion Gold (ENIG), Organic Solderability Preservatives (OSP), Immersion Tin, and Immersion Silver are available. Each treatment option offers different advantages, such as ENIG's excellent surface planarity and OSP's ability to preserve the copper surface for soldering. These treatments are carefully applied to enhance the PCB's performance and longevity, preventing oxidation and ensuring reliable soldering points.
Furthermore, the Rigid Flex PCB product is designed to accommodate Local High Density interconnects, providing the capability to support a higher number of connections within a compact space. This is particularly advantageous for applications that require a large amount of data transfer or power within a limited area. The product also features the option for Back Drilling, a technique used to remove any residual stub from plated through-holes, which can improve signal integrity in high-frequency applications.
In conclusion, the Rigid Flex PCB product is a highly sophisticated solution that blends the flexibility of Flexible Rigid Circuit Boards with the stability of rigid PCBs. It's engineered to support a multitude of components and treatments, offering unparalleled versatility for electronics design. Whether for advanced industrial applications or innovative consumer products, this Rigid Flex PCB stands as a testament to the evolution of printed circuit board technology, promising reliability, functionality, and adaptability in its myriad forms.
Parameter | Description |
---|---|
Bend Radius | 0.5-10mm |
Surface Finishing | HASL LF |
Flexibility | 1-8 Times |
Minimum Trace/Space | 0.1mm |
Material | FR4, Polyimide, PET |
Dimension | 41.55*131mm |
Treatment | ENIG/OSP/Immersion Gold/Tin/Silver |
Sanforized | Local High Density, Back Drill |
No Of Layers | 4 Layer |
Components | SMD, BGA, DIP, Etc. |
The Rigid Flex PCB, with its distinctive dimensions of 41.55*131mm, is adept at fitting into compact spaces while providing ample surface area for various electronic components. This 4-layer board, expandable to a remarkable 52L, combines the robustness of traditional rigid boards with the versatility of flexible circuits, thereby creating a Flexible Rigid Circuit Board that is ideal for dynamic applications where bending and flexing are necessary.
One of the key features of this Rigid Flex PCB is its bend radius, which ranges from 0.5 to 10mm. This feature allows it to be delicately shaped and folded without compromising the integrity of the circuit, making it an exemplary Foldable Rigid Circuit Board. The adaptability of the bending radius means that it can be custom-fitted into irregularly shaped areas, maximizing space in dense electronic assemblies.
With the ability to support various components such as SMD, BGA, DIP, and more, the Flexible-Bendable PCB is a versatile solution for numerous application scenarios. The product is particularly suited for high-reliability environments and applications where the combination of stiff and flexible circuits allows for a 3D assembly, reducing the need for connectors and cables, which leads to increased reliability and a reduction in overall product size.
Application occasions for the Rigid Flex PCB range from wearable technology where flexibility and compact design are crucial, to aerospace and military devices where reliability under harsh conditions is paramount. Additionally, in the medical field, this technology is used in medical devices that require dependable performance and the capability to conform to specific shapes. Consumer electronics, such as smartphones and cameras, also benefit from this PCB's space-saving design and its ability to withstand the repeated motions inherent to their usage.
In industrial applications, the Rigid Flex PCB is invaluable due to its durability and the efficient use of space, which is essential for complex machinery and equipment. Automotive electronics, which are subject to vibrations and require dependable and resilient components, also make extensive use of these boards. The Rigid Flex PCB is engineered to meet the demands of all these scenarios, providing a reliable and flexible circuit solution that integrates the best properties of both rigid and flexible circuit technologies.
We provide comprehensive Product Customization Services for our Rigid Flex PCB products. Our cutting-edge Rigid Flex Printed Wiring Boards are available in a 4 Layer configuration, ensuring robust performance and compatibility with complex designs. With a Minimum Trace/Space of 0.1mm, our Flex-Rigid Printed Circuit Boards allow for high-density layouts, making them perfect for advanced electronic applications.
Our precision engineering guarantees a Hole Position Deviation of only ±0.05mm, ensuring flawless connectivity and reliability. The materials used in the construction of these boards include FR4, Polyimide, and PET, offering a balance of durability and flexibility. Catering to a variety of applications, our Flexible-Bendable PCBs offer a Bend Radius ranging from a tight 0.5mm up to 10mm, accommodating diverse folding requirements and design specifications.
The Rigid Flex PCB product is designed to provide a seamless integration of rigid and flexible circuitry for a wide range of electronic applications. To ensure the highest level of performance and reliability, we offer comprehensive technical support and services for our Rigid Flex PCB customers.
Product Technical Support includes:
Our Services include:
We are committed to providing our customers with the support they need to ensure the success of their projects using our Rigid Flex PCB products. Our dedicated team of experts is ready to assist with any technical challenges that may arise.