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Integrated Circuit Chip K4M513233C-DN75 4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
Integrated Circuit Chip K4M513233C-DN75 4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
Integrated Circuit Chip K4M513233C-DN75 4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
Integrated Circuit Chip K4M513233C-DN75 4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
Specifications
Place of Origin :
KOREA
Brand Name :
SAMSUNG
Certification :
LEAD FREE/ROHS COMPLIANT
Model Number :
K4M513233C-DN75
MOQ :
1
Price :
Contact for Sample
Packaging Details :
Contact for Sample
Delivery Time :
Stock
Payment Terms :
T/T in advance, Paypal, Western Union
Supply Ability :
9600
Package :
90FBGA
Brand :
SAMSUNG
power supply. :
• 3.0V & 3.3V
Commercial Temperature Operation :
(-25°C ~ 70°C).
Description

Quick Detail:

4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA

Description:

The K4M513233C is 536,870,912 bits synchronous high data rate Dynamic RAM organized as 4 x 4,196,304 words by 32 bits, fabricated with SAMSUNG high performance CMOS technology. Synchronous design allows precise cycle control with the use of system clock and I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable burst lengths and programmable latencies allow the same device to be useful for a variety of high bandwidth and high performance memory system applications

Applications:

• 3.0V & 3.3V power supply.

• LVCMOS compatible with multiplexed address.

• Four banks operation.

• MRS cycle with address key programs.

-. CAS latency (1, 2 & 3).

-. Burst length (1, 2, 4, 8 & Full page).

-. Burst type (Sequential & Interleave).

• EMRS cycle with address key programs.

• All inputs are sampled at the positive going edge of the system

clock.

• Burst read single-bit write operation.

• Special Function Support.

-. PASR (Partial Array Self Refresh).

-. Internal TCSR (Temperature Compensated Self Refresh)

• DQM for masking.

• Auto refresh.

• 64ms refresh period (8K cycle).

• Commercial Temperature Operation (-25°C ~ 70°C).

• Extended Temperature Operation (-25°C ~ 85°C).

• 90Balls FBGA

Specifications:

part no.

K4M513233C-DN75

Manufacturer

SAMSUNG

supply ability

1920

datecode

07+

package

BGA

remark

new and original stock

PART NO QTY MFG Package
MC74HC595ADTR2G 10000 ON TSSIP
MC74HC165ADTR2G 7800 ON TSSOP
LM4871MM 4000 NS MSOP
ADXL335BCPZ 22000 AD LFCSP-16
PIC16F648A I/P 30000 MICROCHIP DIP
88SA8040B1-NNC1C000 20000 MARVELL QFN
DF08M 45000 SEP DIP
FR9618SPCTR 10000 FR SOP-8

Competitive Advantage:

Mega Source Electronics stocks components ready to ship. Hard to find, obsolete and highly allocated integrated circuits and semiconductors are all can be found by us.

Mega Source Electronics has established a well-developed logistics system and global logistics network, which can guarantee our service very quick, convenient and efficient.

Product tags

motherboard lenovo lkdgvg1

,

intel atom n270 chipset

,

sdram pc133
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Integrated Circuit Chip K4M513233C-DN75 4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA

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Product Detail
Place of Origin :
KOREA
Brand Name :
SAMSUNG
Certification :
LEAD FREE/ROHS COMPLIANT
Model Number :
K4M513233C-DN75
MOQ :
1
Price :
Contact for Sample
Contact Supplier
Integrated Circuit Chip K4M513233C-DN75 4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
Integrated Circuit Chip K4M513233C-DN75 4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA

Mega Source Elec.Limited

Active Member
13 Years
Since 2004
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Exporter, Trading Company, Seller, Other
Main Products :
Integrated Circuit Chip, Flash Memory IC Chip, Programmable IC Chip
Total Annual :
800 million-900 million
Employee Number :
50~60
Certification Level :
Active Member
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