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AOI Semiconductor wire bonding inspection for die bonding machine and track design
AOI Semiconductor wire bonding inspection for die bonding machine and track design
AOI Semiconductor wire bonding inspection for die bonding machine and track design
AOI Semiconductor wire bonding inspection for die bonding machine and track design
Specifications
Brand Name :
MENTO
Model Number :
S2020
Certification :
FCC.ROHS,CCC
Place of Origin :
DONGGUAN
MOQ :
1
Supply Ability :
10pcs+20 work days
Delivery Time :
20 work days
Packaging Details :
1200mm*1500mm*1800mm
Inspection Type :
2D and 3D
Lighting Source :
UV and white light
Inspection Accuracy :
±3μm
Inspection Resolution :
10μm
Power Supply :
AC 100-240V, 50/60Hz
Software Platform :
Windows
Inspection Range :
Up to 510mm x 510mm
Dimensions :
1000mm x 1000mm x 1500mm
Usage :
Automated Optical Inspection
Inspection Speed :
Up to 1200mm/s
Lighting Type :
LED
Description

S2020 Semiconductor wire bonding inspection

Device model S2020
Detection capacity Detection items Wire bonding inspection
Detection type Ball size, solder offset, solder bridging, miss planting ball, particle, solder overlap, solder break, , welding wrong wire, wire break, wire collapse, wire bridging, wire residue, welding wire interleaving
Optical system Camera 20MP
Telecentric lens telecentric optical lens
Resolution 4um(2.4um~4um optional)
illuminant RGB(can be customized)
Efficiency 3FOV/s
Software system Operating system Ubuntu
Computer configuration Host CPU: Inteli7, RAM: DDR4-128G, GPU: GTX1660-6GB SSD:250G, HDD: 2T
Monitor 22"LED
Operating system Ubuntu
Detection performance PCB Thickness 1~5mm
Component Height 20mm upper, 30mm lower (special height can be customized)
Driving equipment Linear motor + grating ruler
Moving speed Max:600mm/s
PCB transport rail 900+20mm (from the ground to the fixture surface)
Parameters PCB size Max:350mmx300mm Max:370mmx350mm
Power AC220V/50Hz/2000W
Overall size W1120xD980xH1600 mm
Weight ≈800KG
Air pressure requirements ≥0.5Mpa
Environmental requirements Temperature: 5~40℃, relative humidity 25%~80% (no frost)
Upstream and downstream equipment communication Standard SMEMA interface/data communication with die bonding machine

Scientific platform design

AOI Semiconductor wire bonding inspection for die bonding machine and track design

Grinding grade motion track design

High repeatability and positioning accuracy, low noise

High-precision motion control system design

Avoid motion system data loss, ensure high-speed and stable operation, and effectively improve motion acceleration and deceleration.

Overall casting structure

Effectively ensure the stability of the continuous operation of the equipment.

Inspection Items

Gold Wire Inspection:Ball size, solder offset, solder bridging, miss planting ball, particle, solder overlap, solder break, , welding wrong wire, wire break, wire collapse, wire bridging, wire residue, welding wire interleaving.

Core inspection: offset, rotation, particle, scratches, reverse and so on.

AOI Semiconductor wire bonding inspection for die bonding machine and track design

Product tags

cof bonding machine details

,

acf bonding equipment

,

avf bonding machine
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AOI Semiconductor wire bonding inspection for die bonding machine and track design

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Product Detail
Brand Name :
MENTO
Model Number :
S2020
Certification :
FCC.ROHS,CCC
Place of Origin :
DONGGUAN
MOQ :
1
Supply Ability :
10pcs+20 work days
Contact Supplier
AOI Semiconductor wire bonding inspection for die bonding machine and track design
AOI Semiconductor wire bonding inspection for die bonding machine and track design

Dongguan MENTO Intelligent Technology Co., Ltd.

Verified Supplier
2 Years
guangdong
Since 2010
Business Type :
Manufacturer, Seller
Main Products :
3D AOI Machine, AOI Tester, AOI Inspection Equipment
Total Annual :
30000000-40000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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