Application scope
Solder joint and mounted device inspection
Features
1.High speed, single FOV processing time is about 350ms
2.Anti-interference, high precision, large range
3.RGB light source seamlessly integrates 2D information to enhance judgment accuracy
4.Three-dimensional height visualization, which can display three-dimensional RGB data and height heat maps
Technical parameter
Device model | K3412 | |
Detection capacity | Detection items | Miss print, over solder, insufficient solder, solder bridging, solder paste tailing, shape anomany, offset |
Scanning method | Stop&Go | |
Optical system | Camera | 12MP high-speed color industrial camera |
Light Source | 4 DLP light source (raster phase shift technology) and red, green and blue (RGB) light source | |
Resolution | 10μm & 15um (optional) | |
Detection performance | Height accuracy (calibration module) | 1μm (using standard calibration block) |
Volume repeatability | <1% (standard verification block, 3Sigma) | |
Maximum Plate Bending Compensation Value | ±3mm | |
Detection Capability GRR | <10%at6o(+50%tolerance, 5μm resolution) | |
Maximum detection height | 20mm/40mm | |
Solution to shadow problem | Grating phase shifting technology to eliminate shadows & four-directional 3D light source illumination system | |
Plate bending real-time compensation method | Plate Bend Compensation (Z-Tracking+Pad Referencing) | |
Test screen | Color (3D and 2D images displayed together) | |
Driving equipment | Servomotor+Screw Guide | |
Moving speed | 800mm/s | |
Minimum measurable product size | 50mmx50mm | |
Maximum product measurable size | 400mmx500mm | |
PCB thickness | 0.5~6mm | |
Track width adjustment | Automatic width adjustment, manual width adjustment | |
Circuit board conveying/fixing | Belt conveyor/pneumatic clamp fixing | |
Conveying direction | From left to right, right to left | |
Orbital height | 900±20mm | |
Computer Configuration | Mainframe | CPU: Intel i5, RAM: DDR4-16G, GPU: GTX1660-6GB, SSD:250G, HDD: 2T |
Monitor | 22"LED | |
Operating system | Ubuntu | |
Parameters | Overall size | W1000xD1380xH1600mm (excluding alarm light) |
Weight | 1100KG | |
Power source | AC220V/50~60Hz/2000W | |
Air Pressure | 0.5Mpa | |
Software Supported Input Formats | Support Gerber format (274X), ODB++ | |
Environmental requirements | Temperature: 5~40℃, relative humidity: 25%~80% (no frost) | |
Upstream and downstream equipment communication | Standard SMEMA interface |