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GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill
GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill
GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill
GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill
Specifications
Brand Name :
MingSeal
Model Number :
GS600SW
Certification :
ISO CE
Place of Origin :
China
MOQ :
1
Price :
$1000-$150000
Payment Terms :
L/C, T/T, D/A, D/P, MoneyGram, Western Union
Delivery Time :
5-60 days
Packaging Details :
WOODEN
Condition :
New
Voltage :
110V/220V
Automatic grade :
Automatic
Warranty :
One Year
Description

SS101 Wafer-Level Dispensing Machine

For Wafer Form Underfill

SS101 is a highly stable and precise wafer level dispensing system which is developed based on Under fill process requirements of RDL First WLP.

The equipment meets the needs of the semiconductor industry,can be provided with an automatic wafer loading & unloading system , and can automatically realize functions such as wafer handling , alignment , preheating , operation heating and heat dissipation . It is compatible with international semiconductor communication protocols , and is provided with an AMHS automatic loading & unloading robot interface to match the

information management requirements and unmanned management trends.

SS101 System Layout

➀ Loadport & Foup

➁ Aligner

➂ QR code scanning station

➃ Pre-heating station

➄Heat dissipation station

➅GS600SWA Dispensing Machine work station ➆GS600SWB Dispensing Machine work station

➇Robot Handling module

Composition of SS101 Wafer-Level Dispensing System

  • GS600SW wafer-level dispensing machine × 2
  • PC101 wafer loading & unloading machine × 1

Application Fields

  • RDL First WLP
  • CUF Application

SS101 Wafer-Level Dispensing Operation Flow

GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill

Features and Advantages

  • Supporting 8/12-inch wafer dispensing.
  • Dustproof level 10, meeting the environmental requirements of wafer level packaging.
  • ESD protection meeting international IEC and ANSI standards.
  • In the whole process of wafer turnover and operation, the temperature is finely controlled and automatically corrected to meet the CUF process requirements while ensuring the product safety.
  • The whole-process video monitoring facilitates product turnover, operation process observation, and problem tracing and analysis

Technical Specifications

SS101 system GS600SWA * 1 ,GS600SWB * 1, PC101 Wafer Handling Machine * 1 (EFEM)
Application Fields RDL First WLP, CUFApplication
Cleanliness Level Cleanliness of working area

Class 100 (Class 1000 workshop)

Class 10 (Class 100 workshop)


Product Application Fields

 Support for wafer size

φ200mm±0 .5mm, φ300mm±0.5mm

(Standard model supports 12-inch wafers only)
Support for wafer thickness 300-2550μ m
Allowable wafer max. warpage range ＜5mm (as per Robot Finger type)
Allowable max.wafer weight 600g (as per Robot Finger type)
Wafer cassette form 8 inches Open Cassette,12 inches Foup (Standard model supports 12-inch wafers only)


PC101(EFEM)

 Loading&unloading method Loadport+Robots
Pre-Aligner accuracy Round center correction deviation≤±0 . 1mm； Angle correction deviation≤±0 .2 °
Wafer reader Supports SEMI fonts (Flat or concave/convex surfaces) ,non-SEMI fonts
Preheating temp. range Room temperature~180℃
Wafer cooling method Natural cooling or air cooling


Dispensing Motion System

 Transmission mechanisms X/Y: Linear motor Z: Servo motor&Screw module
Repeatability X/Y: ±3μ mZ: ±5μ m
Positioning accuracy X/Y: ±10μ m
Max. movement speed X/Y: 1000mm/s Z: 500mm/s
Max. accelerated velocity X/Y: 1g Z: 0 .5g

Vision System

 Camera pixels 130W
Recognition accuracy ±1 Pixel
Recognition range 12 × 16mm＜Recognition range＜19 .2 ×25 .6mm
Light source Combined three-color light source red, green, white + red
Weighing Calibration System Weighing accuracy 0.01mg


Chuck Table Load Tray

 Vacuum surface flatness deviation ≤ 3 0 um
Heating temp.range Room temperature~180℃
Heating temp. deviation ≤ ± 1 . 5 ℃
Repeatability of lifting height ±10 μ m
Vacuum suction pressure -70~-85Kpa Settable





Facilities

 Footprint (W*D*H) 3075×2200×2200mm(Display unfolded)
Weight 2.9t
Power supply 200~240VAC,47~63HZ (Single-phase voltage adaptation power supply)
Electric current 75A
Power 16.5KW
Inhale (0.5Mpa, 450L/min) ×5 way
Operating ambient temp. 23℃±3℃
Relative humidity of working environment 30 ~ 70%

GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill

Product tags

inp wafer

,

wafer process

,

wafer thinning services
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GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill

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Product Detail
Brand Name :
MingSeal
Model Number :
GS600SW
Certification :
ISO CE
Place of Origin :
China
MOQ :
1
Price :
$1000-$150000
Contact Supplier
GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill
GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill

Changzhou Mingseal Robot Technology Co., Ltd.

Verified Supplier
2 Years
jiangsu, changzhou
Since 2009
Business Type :
Manufacturer
Main Products :
Adhesive Dispensing Machine, Glue Micro Dispenser, Five Axis Dispensing Machine
Total Annual :
9000-12000
Employee Number :
200~500
Certification Level :
Verified Supplier
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