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GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill
GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill
GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill
GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill
Specifications
Brand Name :
MingSeal
Model Number :
GS600SU
Certification :
ISO
Place of Origin :
China
MOQ :
1
Price :
$28000-$150000
Payment Terms :
L/C, T/T, D/A, D/P, MoneyGram, Western Union
Delivery Time :
5-60 days
Packaging Details :
WOODEN
Condition :
New
Warranty :
1 year
Product name :
GS600SU Underfill Dispensing Machine
Application Fields :
FCBGA, FCCSP, Sip
Applicable Process :
Die Form Underfill
Cleanliness Level :
Cleanliness of working area
Transmission system :
X/Y:Linear motor Z： Servo motor&Screw module
Repeatability (3sigma)X/Y :
X/Y： ±0.003mm， Z： ±0.005mm
Positioning accuracy (3sigma) :
X/Y： ±0.010mm， Z： ±0.015mm
Max. movement speed :
X/Y： 1000mm/s Z： 500mm/s
Max. accelerated velocity :
X/Y： 1g， Z： 0.5g
Grating resolution :
1μ m
Z axis movement range(W×D) :
350mm×470mm
Z axis height calibration & compensation Method :
Laser sensor (Laser sensor)
Laser sensor accuracy :
2μ m
Glue control accuracy :
±3%/1mg
Single dot position repeatability CPK＞1.0 :
±25μ m
Min. nozzle diameter :
30μ m
Min. single dot glue weight :
0.001mg/dot
Max. fluid viscosity :
200000cps
Max. jetting frequency :
1000Hz
Footprint W×D×H :
2380mm*1550mm*2080mm(Loading&Unloading& display included) 2380mm*1200mm*2080mm(Loading&Unloading included, display excluded)
Weight :
1600kg
Powersupply :
200~240VAC,47~63HZ (Single-phase voltage adaptation power supply)
Electriccurrent :
30A
Power :
6.4KW
Inhale :
(0.5Mpa， 450L/min) ×2
Automatic grade :
Automatic
Description

GS600SU Underfill Dispensing Machine

For Die Form Underfill

GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill process requirements of FCBGA/FCCSP.

The system strictly controls the product and adhesive temperature, and intelligently sorts the product operation sequence and the glue replenishment time, reducing the generation of voids and ensuring the operation yield. Meanwhile, it is compatible with international semiconductor communication protocols, and matches the infor- mation management requirements.

■ Application Fields
FCBGA Packaging CUF Application FCCSP Packaging CUF Application SiP Packaging CUF Application

■ Technical Specifications

Application Fields FCBGA, FCCSP, SIP
Applicable Process Die Form Underfill
Cleanliness Level Cleanliness of working area

Class 100 (Class 1000 workshop)
Class 10 (Class 100 workshop)




Transmission

Mechanism

 Transmission system X/Y:Linear motor Z: Servo motor&Screw module
Repeatability (3sigma) X/Y: ±0.003mm, Z: ±0.005mm
Positioning accuracy (3sigma) X/Y: ±0.010mm, Z: ±0.015mm
Max. movement speed X/Y: 1000mm/s
Z: 500mm/s
Max. accelerated velocity X/Y: 1g, Z: 0.5g
Grating resolution 1 μ m
Z axis movement range(W× D) 3 5 0 mm×4 7 0mm
Z axis height calibration & compensation Method Laser sensor (Laser sensor)
Laser sensor accuracy 2μ m





Dispensing System

 Glue control accuracy ± 3 % / 1mg
Single dot position repeatability CPK＞1.0 ±25 μ m
Min. nozzle diameter 30 μ m
Min. single dot glue weight 0 .001mg/dot
Max. fluid viscosity 200000cps
Max. jetting frequency 1000Hz
Runner/nozzle heating temperature Room temperature~200℃
Runner/nozzle heating temp. deviation ± 2 ℃
Applicable adhesive packaging spec. 5CC/10CC/30CC/50CC/70CC
Syringe cooling range Cools down to 15°C below ambient temp.
Piezo cooling range Cools down to compressed air source temp.






Track System

 Number of tracks 2
Number of belt sections One piece
Max. track transmission speed 300mm/s
Max. track transmission weight 3kg
Minimum edge clearance 3 mm
Track width adjustment range 60mm~ 162mm Adjustable
Track width adjustment Method Manual
Track height 910mm~960mm Adjustable
Max. thickness of applicable substrate/carrier 6 mm
Applicable substrate/carrier length range 60mm-325mm
Vacuum suction pressure Range -50~-80Kpa Adjustable
Bottom heating temperature range Room temperature~180℃
Bottom heating temp. deviation ≤ ± 1 . 5 ℃



Facilities

 Footpri nt W× D× H 2380mm*1550mm*2080mm(Loading&Unloading& display included)
2380mm*1200mm*2080mm(Loading&Unloading included, display excluded)
Weight 1600kg
Power supply 200~240VAC,47~63HZ (Single-phase voltage adaptation power supply)
Electric current 30A
Power 6.4KW
Inhale (0.5Mpa, 450L/min) ×2
  • FCBGA Packaging CUF Application
  • FCCSP Packaging CUF Application
  • SiP Packaging CUF Application

Special Process Modules

  • GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

    CUF Special Piezoelectric Jetting System
    Adhesive insulation + piezoelectric ceramic temperature closed-loop control to avoid system instability caused by temperature influence

  • GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

    Triple Low-level Alarm
    Capacitive detection + magnetic detection + system weighing to avoid poor operation caused by lack of glue

  • GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

    Vacuum Adsorption Heating Fixture
    The temperature difference of the whole surface of the fixture is ≤ ±1.5°C, and the temperature is monitored and compensated in real time to avoid poor operation caused by product temperature variation during operation

  • GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

    Press-Down Track
    The vacuum adsorption fixture always keeps still, and the track moves up and down to avoid poor operation caused by loss of flatness during reciprocating movement of the vacuum adsorption fixture.

  • GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

    Platform-Type Loading & Unloading System
    The feeding sequence is automatically sorted, and the operation is completed within the Plasma time limit
    Friendly human-machine interface design

  • GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

    Visual system
    Positioning and detection functions
    Inspection before operation to avoid defective incoming materials
    Inspection after operation to prevent batch defects

GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill
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GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

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Product Detail
Brand Name :
MingSeal
Model Number :
GS600SU
Certification :
ISO
Place of Origin :
China
MOQ :
1
Price :
$28000-$150000
Contact Supplier
video
GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill
GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill

Changzhou Mingseal Robot Technology Co., Ltd.

Verified Supplier
2 Years
jiangsu, changzhou
Since 2009
Business Type :
Manufacturer
Main Products :
Adhesive Dispensing Machine, Glue Micro Dispenser, Five Axis Dispensing Machine
Total Annual :
9000-12000
Employee Number :
200~500
Certification Level :
Verified Supplier
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