Mo60Cu40 Thickness1.5mm Molybdenum Copper Alloy Heat Sink Based Sheet For Microelectronics Packaging

1. Introdution Of Thickness 1.5mm MoCu Heat Sink Sheet:

Molybdenum copper substrate is a material widely used in the field of microelectronic packaging. It is composed of two metal materials, molybdenum and copper, and has excellent properties such as high strength, high thermal conductivity, and high reliability. Therefore, molybdenum-copper substrates have excellent thermal conductivity and good mechanical strength, and are ideal for manufacturing high-performance microelectronic packages. choose.

2. Size Of Thickness 1.5mm MoCu Heat Sink Sheet:

The specifications of molybdenum-copper substrates are usually described in terms of thickness and area. Generally speaking, the thickness is between 10-1000 microns, and the area is between several square millimeters and several square centimeters. During the manufacturing process, molybdenum-copper substrates usually need a series of processing and treatment, such as cutting, surface treatment, electroplating and so on. The selection and optimization of these processes has a significant impact on the performance and quality of Mo-Cu substrates.

3.Properties of Thickness 1.5mm MoCu Heat Sink Sheet:

4. Coating Of Thickness 1.5mm MoCu Heat Sink Sheet:

The surface of the molybdenum copper substrate is usually electroplated to improve its electrical properties and corrosion resistance. Common platings include nickel, gold, silver, etc. Nickel plating has excellent corrosion resistance and electrical conductivity, so it is often used in microelectronic packaging. Gold plating has excellent electrical conductivity and solderability, so it is also widely used in microelectronic packaging. Silver plating has excellent electrical and thermal conductivity properties, so it is also widely used in high-performance microelectronic packaging.

This is plated Nickel 5μm of Mo60Cu40 sheet:

5. Application Of Thickness 1.5mm MoCu Heat Sink Sheet:

Molybdenum copper substrates are widely used in the field of microelectronic packaging. It can be used to manufacture various types of package structures, including BGA package, QFN package, COB package, Flip Chip package, etc. At the same time, molybdenum-copper substrates can also be used to manufacture various microelectronic devices, such as power amplifiers, radio frequency modules, microprocessors, sensors, etc.

In general, molybdenum copper substrate is a high-performance material widely used in the field of microelectronic packaging. It has excellent mechanical properties, electrical conductivity and corrosion resistance, and can meet various application requirements. At the same time, the molybdenum copper substrate can also be treated with various coatings to meet different application requirements.

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