Molybdenum Rotary Sputtering Target For Magnetron Target

1. Description Of Molybdenum Rotary Sputtering Target For Magnetron Target:

The molybdenum rotary sputtering target is a magnetron target, which is usually made into a cylindrical shape with a stationary magnet inside, which will rotate at a slow speed during operation. Common product specifications are as follows: ID-133/OD-157x 3191mm; ID-133/OD-157 X 3855mm; ID-160/OD-180x1800mm. We offer molybdenum rotary targets in various regular sizes, and can also be machined according to customer's specific requirements.

Coating materials in the form of molybdenum spin sputtering targets are used to produce molybdenum layers for CIGS back contacts or thin film transistors for flat panel screens (TFT LCD, OLED). Monolithic rotating targets have no liner and are therefore constructed of 100% coating material. These targets can significantly improve sputtering performance while enabling higher throughput. Thus, the increased material yield also reduces the manufacturing cost in the coating process compared to bonded rotating targets.

2. Features Of Molybdenum Rotary Sputtering Target For Magnetron Target:

It has good performance requirements, such as the use temperature of molybdenum rotating target is 1800°C, the highest use temperature is 2310°C, the density is 10.2 g/cm3, and the purity is 99.95%, so it is often used in the preparation of solar cells, architectural glass, Automotive glass, semiconductors, flat-panel TVs, etc.

3. Advantage Of Molybdenum Rotary Sputtering Target For Magnetron Target:

Molybdenum rotating target is a method to improve the utilization rate of molybdenum sputtering target. Compared with the molybdenum planar target, the design of the molybdenum rotating target structure shows the substantial advantages of the molybdenum sputtering target. Target lifetime is defined as sputtering power times sputtering time, or the total thickness of material that can be deposited on the substrate. The change in geometry and design from molybdenum flat target to molybdenum rotary target has increased the utilization rate of the target, and the utilization rate can be increased from 30% to 50% of molybdenum flat target to > 80% of molybdenum rotary target. In addition, if the life of the target material is measured by multiplying the sputtering power by the sputtering time, the life of the molybdenum rotating target is 5 times longer than that of the molybdenum flat target. Since the molybdenum rotary target rotates continuously during the sputtering process, there will be no heavy deposition on its surface.

4. Chemical Content Of Molybdenum Rotary Sputtering Target For Magnetron Target:

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