Product Description: Mo60Cu40 Thickness1.5mm Molybdenum Copper Alloy Heat Sink Based Sheet For Microelectronics Packaging 1. Introdution Of Thickness 1.5mm MoCu Heat Sink Sheet: Molybdenum copper substrate is a material ...learn more
Mo60Cu40 1.5mm Molybdenum Copper Alloy Sheet Heat Sink Based For Microelectronics Packaging

Mo60Cu40 1.5mm Molybdenum Copper Alloy Sheet Heat Sink Based For Microelectronics Packaging
500000pcs/month
$0.1~5.0/pc
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Shaanxi Peakrise Metal Co.,Ltd

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3 Years
Replace a batch

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