Product Description: Molybdenum Copper Substrates For Heat Dissipation 1. Information Of Molybdenum Copper Substrates For Heat Dissipation: Molybdenum-copper substrate is a new type of electronic material. It uses ...learn more
3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT

3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT
50000pcs/month
$5~150/pc
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Shaanxi Peakrise Metal Co.,Ltd

Site Member
3 Years
Replace a batch

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