-The yield rate of wafers is required exceed 97%. Only few manufacturers of wafer can meet our requirements because it needs advanced technical expertise.

-We trim about 6-10 mm from the wafer's width to ensure a higher yield rate and remove any potentially damaged chips from the outer ring.

-The wire in package we use is 15 um at least while other manufacturer is widely using 12 um.

-If the yield rate of products is lower than 97% after sealing and testing, we will destroy the whole butch.

Certification

Standard: REACH of Package-1

Number: SZXEC23001228915

Issue Date: 2023-06-27

Scope/Range: MOSFET

Issued By: SGS-CSTC Standards Technical Services Co., Ltd.

Standard: ISO9001

Number: 06522Q01798R1M

Issue Date: 2022-06-29

Expiry Date: 2025-06-28

Scope/Range: R&D and sales of discrete semiconductor devices (semiconductor components, semiconductor chips)

Issued By: CFL CERTIFICATION CENTER

Standard: PAHs PFOS PFOA Testing of Package-1

Number: SZXEC23001228913

Issue Date: 2023-06-27

Scope/Range: MOSFET

Issued By: SGS-CSTC Standards Technical Se

Standard: Halogen-free Certification of Package-1

Number: SZXEC23001228911

Issue Date: 2023-07-27

Scope/Range: MOSFET

Issued By: SGS-CSTC Standards Technical Se

Standard: PAHs PFOS PFOA Testing of Package-1

Number: SZXEC23001228913

Issue Date: 2023-06-27

Scope/Range: MOSFET

Issued By: SGS-CSTC Standards Technical Se

Standard: MSDS of TO-252

Issue Date: 2021-03-15

Issued By: Reasunos Semiconductor

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