Multi Functional Mosfet Power Switch / AP8810TS High Current Mosfet Switch
General Description:
Mos Field Effect Transistor are used in many power supply and general power applications, especially as switches. Variant s include planar MOSFETs, VMOS, UMOS TrenchMOS, HEXFETs and other different brand names.
General Features
VDS = 20V,ID = 7A
RDS(ON) < 28mΩ @ VGS=2.5V
RDS(ON) < 26mΩ @ VGS=3.1V
RDS(ON) < 22mΩ @ VGS=4V
RDS(ON) < 20mΩ @ VGS=4.5V
ESD Rating:2000V HBM
Application
Battery protection
Load switch Power management
Package Marking and Ordering Information
Product ID | Pack | Marking | Qty(PCS) |
AP8810TS | TSSOP-8 | AP8810E XXX YYYY | 5000 |
ABSOLUTE MAXIMUM RATINGS(TA=25 ℃unless otherwise noted)
Parameter | Symbol | Limit | Unit |
Drain-Source Voltage | VDS | 20 | V |
Gate-Source Voltage | VGS | ±12 | V |
Drain Current-Continuous@ Current-Pulsed (Note 1) |
ID | 7 | A |
IDM | 25 | A | |
Maximum Power Dissipation | PD | 1.5 | W |
Operating Junction and Storage Temperature Range | T J ,T STG | -55 To 150 | ℃ |
Thermal Resistance,Junction-to-Ambient (Note 2) | RθJA | 83 | ℃/W |
Parameter | Symbol | Limit | Unit |
Drain-Source Voltage | VDS | 20 | V |
Gate-Source Voltage | VGS | ±12 | V |
Drain Current-Continuous@ Current-Pulsed (Note 1) |
ID | 7 | A |
IDM | 25 | A | |
Maximum Power Dissipation | PD | 1.5 | W |
Operating Junction and Storage Temperature Range | T J ,T STG | -55 To 150 | ℃ |
Thermal Resistance,Junction-to-Ambient (Note 2) | RθJA | 83 | ℃/W |
ELECTRICAL CHARACTERISTICS (TA=25 ℃unless otherwise noted)
Parameter | Symbol | Condition | Min | Typ | Max | Unit |
Drain-Source Breakdown Voltage | BV DSS | V GS=0V ID=250 μA | 20 | V | ||
Zero Gate Voltage Drain Current | IDSS | V DS=20V,V GS=0V | 1 | μA | ||
Gate-Body Leakage Current |
IGSS |
V GS=±4.5V,V DS=0V | ±200 | nA | ||
V GS=±10V,VDS=0V | ±10 | uA | ||||
Gate Threshold Voltage | V GS(th) | V DS=V GS,ID=250 μA | 0.6 | 0.75 | 1.2 | V |
Drain-Source On-State Resistance |
RDS(ON) |
V GS=4.5V, ID=6.5A | 14 | 20 | m Ω | |
V GS=4V, ID=6A | 16 | 22 | m Ω | |||
V GS=3.1V, ID=5.5A | 19 | 26 | m Ω | |||
V GS=2.5V, ID=5.5A | 24 | 28 | m Ω | |||
Forward Transconductance | gFS | V DS=10V,I D=6.5A | 6.6 | S | ||
Input Capacitance | Clss | 650 | PF | |||
Output Capacitance | Coss | 360 | PF | |||
Reverse Transfer Capacitance | Crss | 154 | PF | |||
Turn-on Delay Time | td(on) | 11 | 22 | nS | ||
Turn-on Rise Time |
r t |
12 | 28 | nS | ||
Turn-Off Delay Time | td(off) | 35 | 73 | nS | ||
Turn-Off Fall Time |
f t |
33 | 65 | nS | ||
Total Gate Charge | Qg |
V DS=10V,I D=7A, V GS=4.5V |
11 | 16 | nC | |
Gate-Source Charge | Qgs | 2.5 | nC | |||
Gate-Drain Charge | Qgd | 3.2 | nC | |||
Diode Forward Voltage (Note 3) | V SD | V GS=0V,IS=1.5A | 0.84 | 1.2 | V |
Parameter | Symbol | Condition | Min | Typ | Max | Unit |
Drain-Source Breakdown Voltage | BV DSS | V GS=0V ID=250 μA | 20 | V | ||
Zero Gate Voltage Drain Current | IDSS | V DS=20V,V GS=0V | 1 | μA | ||
Gate-Body Leakage Current |
IGSS |
V GS=±4.5V,V DS=0V | ±200 | nA | ||
V GS=±10V,VDS=0V | ±10 | uA | ||||
Gate Threshold Voltage | V GS(th) | V DS=V GS,ID=250 μA | 0.6 | 0.75 | 1.2 | V |
Drain-Source On-State Resistance |
RDS(ON) |
V GS=4.5V, ID=6.5A | 14 | 20 | m Ω | |
V GS=4V, ID=6A | 16 | 22 | m Ω | |||
V GS=3.1V, ID=5.5A | 19 | 26 | m Ω | |||
V GS=2.5V, ID=5.5A | 24 | 28 | m Ω | |||
Forward Transconductance | gFS | V DS=10V,I D=6.5A | 6.6 | S | ||
Input Capacitance | Clss | 650 | PF | |||
Output Capacitance | Coss | 360 | PF | |||
Reverse Transfer Capacitance | Crss | 154 | PF | |||
Turn-on Delay Time | td(on) | 11 | 22 | nS | ||
Turn-on Rise Time |
r t |
12 | 28 | nS | ||
Turn-Off Delay Time | td(off) | 35 | 73 | nS | ||
Turn-Off Fall Time |
f t |
33 | 65 | nS | ||
Total Gate Charge | Qg |
V DS=10V,I D=7A, V GS=4.5V |
11 | 16 | nC | |
Gate-Source Charge | Qgs | 2.5 | nC | |||
Gate-Drain Charge | Qgd | 3.2 | nC | |||
Diode Forward Voltage (Note 3) | V SD | V GS=0V,IS=1.5A | 0.84 | 1.2 | V |
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300 μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production testing.
Attention
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