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Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352
Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352
Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352
Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352
Specifications
MOQ :
1 pcs
Payment Terms :
L/C, T/T
Delivery Time :
12-14weeks
Packaging Details :
boxes
Brand Name :
Xilinx
Model Number :
XQV300-4BG352N
Place of Origin :
USA
Price :
Negotiable
Package :
PLASTIC, BGA-352
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max :
0.8 ns
JESD-30 Code :
S-PBGA-B352
Operating Temperature-Min :
-55.0 Cel
Supply Voltage-Nom :
2.5 V
Supply Voltage-Max :
2.625 V
Technology :
CMOS
Terminal Finish :
Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s) :
30
Description

Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

Descriptions of Aviation Parts :

The QProTM VirtexTM FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 0.22 µm CMOS process. These advances make QPro Virtex FPGAs powerful and flexible alternatives to mask-programmed gate arrays. The Virtex family comprises the four members shown in Table 1. Building on experience gained from previous generations of FPGAs, the Virtex family represents a revolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the QPro Virtex family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market. Refer to the "VirtexTM 2.5V Field Programmable Gate Arrays" commercial data sheet for more information on device architecture and timing specifications.

Features of Aviation Parts:

Certified to MIL-PRF-38535 (Qualified Manufacturer Listing) Guaranteed over the full military temperature range to +125°C) Ceramic and Plastic Packages Fast, high-density Field-Programmable Gate Arrays Densities from to 1M system gates System performance to 200 MHz Hot-swappable for Compact PCI 16 high-performance interface standards Connects directly to ZBTRAM devices Four dedicated delay-locked loops (DLLs) for advanced clock control Four primary low-skew global clock distribution nets, plus 24 secondary global nets LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register Configurable synchronous dual-ported 4K-bit RAMs Fast interfaces to external high-performance RAMs Dedicated carry logic for high-speed arithmetic Dedicated multiplier support Cascade chain for wide-input functions Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset Internal 3-state bussing IEEE 1149.1 boundary-scan logic Die-temperature sensing device

Specification of Aviation Parts :

Mfr Package Description

PLASTIC, BGA-352
REACH Compliant Yes
Status Discontinued
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max 0.8 ns
JESD-30 Code S-PBGA-B352
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of CLBs 1536.0
Number of Equivalent Gates 322970.0
Number of Inputs 260.0
Number of Logic Cells 6912.0
Number of Outputs 260.0
Number of Terminals 352
Operating Temperature-Min -55.0 Cel
Operating Temperature-Max 125.0 Cel
Organization 1536 CLBS, 322970 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225
Power Supplies 1.2/3.6,2.5
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 1.7 mm
Sub Category Field Programmable Gate Arrays
Supply Voltage-Nom 2.5 V
Supply Voltage-Min 2.375 V
Supply Voltage-Max 2.625 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Length 35.0 mm
Width 35.0 mm

Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

Product tags

deutz f6l912 parts

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isuzu dmax 4x4 parts

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vickers pve19 parts
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Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

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Product Detail
MOQ :
1 pcs
Payment Terms :
L/C, T/T
Delivery Time :
12-14weeks
Packaging Details :
boxes
Brand Name :
Xilinx
Model Number :
XQV300-4BG352N
Contact Supplier
Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352
Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

XIXIAN FORWARD TECHNOLOGY LTD

Verified Supplier
3 Years
Shaanxi
Since 2010
Business Type :
Exporter, Trading Company, Seller
Main Products :
Aviation Parts, Thermal Imaging Monocular, Laser Rangefinder Module
Total Annual :
7.39 million-8.66 million
Employee Number :
50~55
Certification Level :
Verified Supplier
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