Package / Case : :
676-BGA
Product Category : :
Systems on a Chip - SoC
Primary Attributes : :
FPGA - 60K Logic Modules
Supplier Device Package : :
676-FBGA (27x27)
Connectivity : :
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature : :
-40°C ~ 125°C (TJ)
Architecture : :
MCU, FPGA
Core Processor : :
ARM® Cortex®-M3
Product status : :
Active
Peripherals : :
DDR, PCIe, SERDES
Series : :
Automotive, AEC-Q100, SmartFusion®2
Manufacturer : :
Microchip Technology
Description :
IC SOC CORTEX-M3 166MHZ 676FBGA