0.075mm Multilayer Pcb Manufacturing Controller PCB Prototype Assembly
ADVANCED INSPECTION MACHINE:
FASTPCBA Co., LIMITED advanced PCB production and testing equipment purchased from the United States, Japan, Germany, Israel and other places to improve production testing and technical capabilities. Adopting international advanced process technology and advanced management methods, the technological level is constantly improved from their high standards and strict requirements.
PRODUCT APPLICATION:
PCBA solder joint inspection (BGA, CSP, POP and other components inspection)
Battery (Pole piece solder joint defect detection, cell winding condition detection)
Electronic connectors (harnesses, cables, plugs, etc.)
Automotive electronics (testing of patch cords, dashboards, etc.)
Solar, photovoltaic (wafer solder joint inspection)
Testing for special industries such as aviation components
Semiconductor (package component inspection)
LED detection
Electronic module detection
Ceramic products testing
Electronics Oem Industrial Pcba Service
FASTPCBA is the top 10 manufacturing and pcb assembly factory globally, with ISO 14000, 13485, ISO9001, and IATF16949 certificates simultaneously, can provide better pcba service for customers from Iot pcba aerospace pcba, military pcba, communication pcba, industrial pcba, medical pcba, automotive pcba etc.
FASTPCBA keeps pace with the times, has imported advanced X-RAY, 3D AOI, selective wave soldering, MADATA, YAMAHA etc equiments, we can provide original package componets agent service, custom pcb manufacturing, precise pcb assembly, accurate pcb printing, save your cost and time at the same time.
FASTPCBA survival more than 20 years, as our goal is always provide best quality pcba solution for customers from domestic and abroad like Gemany, Russia, Brazil, Japan, America, France, UK etc. FASTPCBA can turn your pcb design to pcba or pcb assp, welcome to inquiry and visit us in shenzhen china.
PCB Capability
Article | Description | Capability |
Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
Board Cutting | Number of layers | 1-48 |
Min.thickness for inner layers | 0.003”(0.07mm) | |
Board Thickness | Standard | (0.1-4mm±10%) |
Min. | Single/Double:0.008±0.004” | |
4layer:0.01±0.008” | ||
8layer:0.01±0.008” | ||
Bow and twist | no more than 7/1000 | |
Copper Weight | Outer Cu weight | 0.5-4 0z |
Inner Cu weight | 0.5-3 0z | |
Drilling | Min size | 0.0078”(0.2mm) |
Drill deviation | ±0.002″(0.05mm) | |
PTH hole tolerance | ±0.002″(0.005mm) | |
NPTH hole tolerance | ±0.002″(0.005mm) | |
Solder Mask | Color | Green,white,black,red,blue… |
Min solder mask clearanace | 0.003″(0.07mm) | |
Thickness | (0.012*0.017mm) | |
Silkscreen | Color | white,black,yellow,blue… |
Min size | 0.006″(0.15mm) | |
Max Size of Finish Board | 700*460mm | |
Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
PCB Outline | Square,circle,irregular(with jigs) | |
Package | QFN,BGA,SSOP,PLCC,LGA |
PRODUCT CONFIGURATION:
4/2 (optional 6-inch) image intensifier and megapixel digital camera;
90KV / 100KV-5 micron X-ray source
Simple mouse click operation to write detection program;
High detection repeat accuracy;
Rotational tilt of plus or minus 60 degrees allows unique perspectives to detect samples;
High-performance stage control;
Large navigation window-easy to locate and identify defective products;
Automatic BGA detection program accurately detects every BGA bubble
Make judgments according to customer needs and output Excel reports.