Prototype and Mass Production for Electronic PCB Board SMT 0.6mm thickness Assembly ENIG
Quality is what Linked Electronics always pursue. We have won great reputation among our customers for our quality. After each process, there will be quality test at Linked Electronics, in this way, there will be no potential quality issue boards to be ignored and send to customer.
Linked Electronics has TS16949, UL, Rohs certification, and all our manufacturing procudure are performed according to IPC class standard.
If you need any electronics multilayer PCB board, aluminum PCB board, Rogers PCB board, heavy copper PCB, rigid flex PCB, quick turn PCB, SMT service, PCB assembly service and other PCB service, contact us today. Linked Electronics will be happy to provide you any service.
Product Name
| Electronic PCBA Board for Communication Industry |
PCB Spec
| 1.6mm, 1oz, black soldermask, white legend, hard gold, gold finger |
Lead Time
| 30 days |
Manfuacturing Standard
| IPC Class 2, IPC Class 3 standard |
Test Method
| AOI, Function Test, Fixture |
Quality Assurance at Linked Electronics, the PCB factory in China.
Linked Electronics is always trying our best to ship customer with 100% qualified PCB products.
To prevent potential quality issue, there are many quality test before shipping the PCB board. Let's take a look at the thermal stress test to detect any possible lamination issue.
Generally, the maximum temperature that electronic PCB board can withstand is 300 degrees, 5~10 seconds.
The reflow oven temperature of lead free is 260 degrees and 240 degrees for lead process.
How to carry out thermal stress test?
1.Prepare finished PCB sample and solder pot.
Take a 100mm*100mm finished electronic PCB sample 5pcs( no blister on the FR4)
1~2 Layer: 10 cycles and above
Multilayer PCB: 0 Cycles and above.
High TG material: 10 cycles and above.
2.Set the solder pot at the temperate 288 degree+/-5 degree.
3.Brush flux onto the PCB board and sink into the solderpot for 10 second to check if there any blister, this is 1 cycle.
4.If there is blister, stop and analyze the cause f/m. If no problem is detected, test will be continued until blister is found.
The test be stopped at 20 cycles if no issue if found.
5.Micro-section will be made to check the blister location
This is the one process of standard electronic PCB board test at Linked Electronic. We are always trying to deliver qualified PCB board with on time delivery.