Multilayer LCD Rigid Flex Printed Circuit Board Assembly 8 Layer HASL Lead Free
Linked Electronics is a PCB manufacturer with full in house manufacturing capabilities in China. We have been in business for more than 2 decades specializing in quick turn, high quality custom PCB fabrication.
We have acheived highest standard of PCB fabrication industry. And our consistent good quality wins customers around the world.
Linked Electronics Rigid Flex PCBs are used in following products
1. Displayer
2. PC and Computer
3. Flat screen TV
4. Printer, Scanner, FAX machine, Copier.
5. Sound Box
6. MP3, MP4
7. CD/ DVD
8. Digital camera
9. Fax machine and copier
10.Scanner
11. Acoustics
12. Tablet PC
Contact Linked Electronics today and let's discuss your PCB request.
OEM/ODM Services: | |||
Layers | 1-32 layers | Min. line width | 2mil |
Max.board size (single&doule sided) | 700*1200mm | Min.annular ring width: vias | 3mil |
Surface finish | HAL(with Pb free), plated Ni/Au, Immersion silver, Imm Ni/Au,Imm Sn, hard gold,OSP,ect | Min.board thickness(multilayer) | 4layers:0.4mm; 6layers:0.6mm; 8layers:1mm; 10layers:1.2mm |
Board materials | FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon,ISOLA, polyclad 370 HR); thick copper | Plating thickness (Technique: Immersion Ni/Au) | Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
Impedance control | ± 10% | Distance between line to board edge | Outline: 0.2mm V-CUT: 0.4mm |
Base copper thickness (Inner and outer layer) | Min. thickness:1/3 OZ Max.thickness:6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
Finished copper thickness | Outer layers: Min.thickness 1 OZ, Max.thickness 10 OZ Inner layers: Min.thickness 0.5OZ, Max.thickness 6 OZ | Max.board thickness (single&doule sided) | 6mm |
Linked Electronics provides one-stop PCB custom services
1. Offering good quality PCB/PCBA to our customer, Linked will do many kinds of testing to ensure quality before shipment
2.Outgoing test to check min PTH Cu thickness, Min surface Cu thickness, ENIG Au data,Ni data, Au layer adhesion testing, soldermask adhesion testing, silkscreen adhesion testing, Thermal stress testing, hardness testing, Twist/Warp record, microsection report and e-test.
3.Thermal Stress Test to avoid any Delamination, Measling and others.
4.Solderability of PTH to avoid any discolor, Wrinkles, Blisters, Measling, Blow-Hole, Soldermask peel off, and soldermask filled in hole-wall incompletely.
Impedance testing, and so on……
Please feel free to contact with us!