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Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver
Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver
Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver
Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver
Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver
Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver
Specifications
Brand Name :
OEM and ODM
Model Number :
SL80815S002
Certification :
UL,RoHS, CE
Place of Origin :
China
MOQ :
1pc
Price :
Negotiable
Payment Terms :
T/T, Western Union, MoneyGram,Paypal
Supply Ability :
1000pcs per day
Delivery Time :
5-7 days
Packaging Details :
ESD package
Copper thickness :
4OZ
Surface finish :
Immersion Tin, Silver
Certificate :
UL, RoHS
Features 1 :
Gerber/PCB file needed
Features 2 :
100% E-test
Features 3 :
Quality 2 years guarantee
Description

Thick copper 4OZ FR4 printed circuit board Prototype Immersion Tin / Silver

4OZ FR4 PCB Specifications

Thick copper printed circuit board
a). Impressive Quality
b). Fast Lead Time
c). Good Service

Thick copper printed circuit board

Process Capability

ltem

Mass Production

Prototype

Surface Treatment

HASL(LF)

HASL(LF)

Immersion Gold

Immersion Gold

Flash Gold

Flash Gold

OSP

OSP

Immersion Tin

Immersion Tin

Immersion Silver

Immersion Silver

HASL&Gold Finger

HASL&Gold Finger

selective nickel

selective nickel

HASL(LF)

smt Pad:>3um

smt Pad:>4um

Big Cu:>lum

Big Cu:>l.5um

Immersion Tin

0.4-0.8um

0.8-1.2um

Immersion Gold

Ni:2-5urn

Ni:3-6urn

Au:0.05-0.10um

Au:0.075-0.15um

Immersion Silver

0.2-0.6um

0.3-0.6um

OSP

0.1-0.4um

0.25-0.4um

Flash Gold

Ni:3-6urn

Ni:3-6urn

Au:0.01-0.05um

Au:0.02-0.075um

Laminates

CEM-3,PTFE

CEM-3,PTFE

FR4 (HighTG etc)

FR4(HighTG etc)

Metal Base(AL,CUetc)

Metal Base(AL,CUetc)

Rogors,etc

Rogors,etc

MAX.Layers

12(Layers)

40(Layers)

MAX.Board Size

20"X48"

20"X48"

Board Thickness

O.4mm~6.0mm

<O.4mm or >8.0mm

Max.Copper Thickness

inner Layer:16oz

inner Layer:16oz

Outer Layer:16oz

Outer Layer:16oz

Min.Track Width

3mil/0.075mm

3mil/0.075mm

Min.Track Space

3mil/0.075mm

3mil/0.075mm

M.in Hole Size

8mil/0.2mm

6mil/0.1mm

M.in Laser Hole Size

4mil/0.1mm

3mil/0.076mm

PTH Wall Thickness

0.8mil/20um

1.2mil/30um

PTH Dia.Tolerance

±2mil/±50um

±2mil/±50um

Aspect Ratio

12:1

15:1

lmpedance Control

±5%

±5%

PCBA Technology Capability

· Smallest chip placement:0201

· Automated axial insertion and Automated radial insertion

· Computer controlled Pb free wave soldering system

· High speed Pb free surface mount production lines

· Providing electronic components purchase service for the customers

· ICT on line inspection, PCBA function test equipment, Visual inspection

Mould And Box build Service

· Box Build

· Plastic injection

· Finish Packaging

PCB Picture

Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver

Product tags

nickel plating pcb

,

copper plating in pcb

,

copper plating pcb
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Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver

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Product Detail
Brand Name :
OEM and ODM
Model Number :
SL80815S002
Certification :
UL,RoHS, CE
Place of Origin :
China
MOQ :
1pc
Price :
Negotiable
Contact Supplier
Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver
Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver
Thick Copper 4OZ FR4 Printed Circuit Board Prototype Immersion Tin/Silver

Shenzhen Shinelink Technology Ltd

Active Member
8 Years
guangdong, shenzhen
Since 2005
Business Type :
Manufacturer, Trading Company
Main Products :
PCBA Board, Turnkey PCB Assembly, LED PCB Assembly
Total Annual :
8 million-10 million
Employee Number :
250~300
Certification Level :
Active Member
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