CEM1/CEM3 pcba board for air conditioner control system pcb asembly
Files Requested For PCB Assembly Quotation
---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required
Shinelink kinds PCBA Products
PCB Assembly Capabilities
Turnkey PCBA | PCB+components sourcing+assembly+package |
Assembly details | SMT and Thru-hole, ISO lines |
Lead Time | Prototype: 15 work days. Mass order: 20~25 work days |
Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test |
Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK |
Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) |
Components: Bill of Materials(BOM list) | |
Assembly: Pick-N-Place file | |
PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) |
Max size: 20*20 inches(500*500mm) | |
PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
Components details | Passive Down to 0201 size |
BGA and VFBGA | |
Leadless Chip Carriers/CSP | |
Double-sided SMT Assembly | |
Fine Pitch to 0.8mils | |
BGA Repair and Reball | |
Part Removal and Replacement | |
Component package | Cut Tape,Tube,Reels,Loose Parts |
PCB assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |
PCB Feature
Number of Layer | 1 - 20 Layer |
Maximum Processing Area | 680 × 1000MM |
Min Board Thickness | 2 Layer - 0.3MM ( 12 mil ) |
4 Layer - 0.4MM ( 16 mil ) | |
6 Layer - 0.8MM ( 32 mil ) | |
8 Layer - 1.0MM ( 40 mil) | |
10 Layer - 1.1MM ( 44 mil ) | |
12 Layer - 1.3MM ( 52 mil ) | |
14 Layer - 1.5MM ( 59 mil ) | |
16 Layer - 1.6MM ( 63 mil ) | |
18 Layer - 1.8MM ( 71 mil ) | |
Finished Board Thickness Tolerance | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% | |
Twisting and Bending | ≤ 0.75%, Min: 0.5% |
Range of TG | 130 - 215 ℃ |
Impedance Tolerance | ± 10%, Min: ± 5% |
Hi-Pot Test | Max: 4000V/10MA/60S |
Surface Treatment | HASL, With Lead, HASL Free Lead |
Flash Gold, Immersion Gold | |
Immersion Silver, Immersion Tin | |
Gold Finger, OSP |
PCBA Board Advantage
1. ISO& UL certified third-party testing and high-quality technical service team.
2. Available and immediate delivery.
3. Producing capacity: 20,000sq meter/month.
4. Competitive price with no MOQ.
FAQ:
1. What’s the definition of PCB, PWB and FPC and what’s the difference?
PCB is short for Printed Circuit Board;
PWB is short for Printed Wire Board, same meaning as Printed Circuit Board;
FPC is short for Flexible Printed Board.
2. What factors should be considered when choosing the material for a PCB board?
Below factors should be considered when we choose the material for PCB:
The material’s Tg value should be greater than the operation temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high frequency PCB; Polyimide glass fiber substrate used for flexible PCB; Metal core is used when the product has strict requirement of heat dissipation.
3. What’s the merits of O-leading's rIgid-flex PCB?
O-leading’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.