Multilayer PCB is a circuit board that has more than two layers.
Unlike a Double-Sided PCB which only has two conductive layers of material, all multilayer PCBs must have at least three layers of conductive material which are buried in the center of the material.
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How Are Multilayer PCBs Made?
Alternating layers of prepeg and core materials are laminated together under high temperature and pressure to produce Multilayer PCBs. This process ensures that air isn't trapped between layers, conductors are completely encapsulated by resin, and the adhesive that holds the layers together are properly melted and cured. The range of material combinations is extensive from basic epoxy glass to exotic ceramic or Teflon materials.
Detailed specification of PCB manufaturing capacity:
Surface processing type | HASL/ plating gold /immersion gold/ Ni/Au plating gold finger/OSP processing/immersion Tin (Sn) |
Layers | single-sided,double-sided |
Min trace width | 6mil |
Min space width | 6mil |
Min trace to pad/pad to pad space | 6mil |
Min drill diameter | 0.2mm |
Min via pad | 0.6mm |
Max board size | 560mmX720mm |
Molding board thickness | 0.6-3.00mm |
Min solder mask dam | 6mil |
Min solder mask clearance | 1.5mil |
Min solder mask thickness | 10um |
Solder mask type | Green/yellow/black/red/white/blue or transparent photosensitive solder mask and peel off blue glue. |
Min silk legend width | 6mil |
Min silk legend height | 25mil |
Silk legend color | White/ yellow /black |
Data file format | GERBER file and corresponding drilling file,PROTEL series,PADS2000,POWERPCB series, ODB++ |
Gerber file and Corresponding Broach file, PROTEL series,PADS2000,POWERPCB series, ODB++ | |
Electricity performance testing | 100% electrical performance testing,high pressure testing |
Electricity performance testing | 100%electricity performance testing, high-pressure testing |
Various types base material to PCB processing | High TG board, high frequency board(ROGERS) halogen-free board (FR-4,CEM-1,CEM-3) |
Other testing request | Impendence testing, Hole resistance testing, gold slice up, Solder ability. |
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