HDI Circuit Board
HDI is the abbreviation of High Density Interconnector. It is a (technology) for the production of printed circuit boards. It uses micro-blind and buried via technology for a circuit board with a relatively high line distribution density. HDI is a compact product designed for small-capacity users. It adopts modular design that can be connected in parallel. One module has a capacity of 1000VA (1U height) and is naturally cooled. It can be directly placed in a 19" rack, and up to 6 modules can be connected in parallel. The product adopts full digital signal processing (DSP) technology and multiple Patented technology, with full range of adaptable load capacity and strong short-term overload capacity, regardless of load power factor and crest factor.
PCB Capacities and Technical Specification
PCBA Capabilities
HDI Circuit Board Application
While electronic design continues to improve the performance of the whole machine, it is also working hard to reduce its size. In small portable products ranging from mobile phones to smart weapons, "small" is an eternal pursuit. High-density integration (HDI) technology can make terminal product designs more compact, while meeting higher standards of electronic performance and efficiency.
HDI is widely used in mobile phones, digital (camcorder) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method. The more build-up times, the higher the technical grade of the board. Ordinary HDI boards are basically one-time build-up. High-end HDI uses two-time or more build-up technology. At the same time, advanced PCB technologies such as stacking holes, electroplating and filling holes, and laser direct drilling are used. High-end HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.